Wire bond Technician

Tata Electronics; Mayang; On-site; INR 900,000 - 1,300,000; Full time

Job summary

Tata Electronics is seeking an experienced Wire Bonding Department Lead to drive operations in our semiconductor manufacturing facility. You will guide the wire bonding team, set priorities, and ensure production goals are met with high quality and efficiency.

Responsibilities include establishing SOPs, monitoring process parameters, collaborating with engineering and QA, and driving continuous improvements, cost reductions, and yields across the department.

Qualifications

• Extensive experience in wire bonding operations in the semiconductor industry.
• Proven leadership in managing wire bond teams.
• Deep knowledge of wire bonding techniques and equipment.
• Ability to set up and operate wire bonding equipment per established procedures.
• Lead, coach, and develop team members.
• Maintain accurate records of process parameters and quality data.
• Develop and update SOPs for wire bonding processes.

Responsibilities

• Lead and manage the wire bond team, providing guidance, coaching, and support.
• Foster a collaborative and high-performance work environment within the wire bonding department.
• Conduct inspections of wire bonds to ensure they meet quality standards and specifications.
• Troubleshoot and resolve issues related to wire bonding processes, collaborating with CFT teams to enhance efficiency, quality and yield.
• Maintain records of production activities and process data.
• Collaborate with engineering teams to implement improvements and innovations in wire bonding technology.
• Establish and enforce quality control measures for wire bonding operations.
• Communicate effectively with stakeholders to address challenges and optimize workflows.
• Identify opportunities for cost savings and productivity enhancements.

Skills

Leadership

Wire bonding

Semiconductor

Process setup

Team management

Quality control

Troubleshooting

Documentation

SOP development

Cross-functional

Job description

• Extensive experience in wire bonding operations within the semiconductor industry, with a proven track record of leadership.
• In-depth knowledge of various wire bonding techniques and equipment.
• Set up and operate wire bonding equipment according to established procedures.
• Lead and manage the wire bond team, providing guidance, coaching, and support.
• Foster a collaborative and high-performance work environment within the wire bonding department.
• Conduct inspections of wire bonds to ensure they meet quality standards and specifications.
• Troubleshoot and resolve issues related to wire bonding processes, collaborating with CFT teams when necessary to enhance efficiency, quality and yield.
• Maintain accurate records of production activities, including process parameters, equipment settings, and quality control data.
• Contribute to the creation and updating of standard operating procedures (SOPs) related to wire bonding processes.
• Collaborate with engineering teams to implement improvements and innovations in wire bonding technology.
• Establish and enforce quality control measures for wire bonding operations.
• Ensure compliance with industry standards and customer specifications.
• Perform routine maintenance on wire bonding equipment to ensure optimal functionality.
• Develop and implement strategic plans for the wire bonding department in alignment with overall organizational goals.
• Identify opportunities for cost savings, productivity enhancements, and technological advancements.
• Collaborate with other department heads, including engineering, production, and quality assurance, to achieve seamless integration of processes.
• Communicate effectively with stakeholders to address challenges and optimize workflows.
• Identify and address skill gaps within the team.
• Ensure accurate documentation of wire bonding processes, equipment settings, and quality control data.
• Communicate effectively with team members to address issues and drive continuous improvement.
• Generate reports on departmental performance and key metrics.