Wire Bond Technician

Tata Electronics; Assam; On-site; INR 1,200,000 - 2,400,000; Full time

Job summary

Tata Electronics in Assam, India is seeking a senior wire bonding lead to oversee operations in the semiconductor manufacturing line. You will lead the wire bond team, set up and run bonding equipment, and drive quality, yield, and continuous improvement initiatives.

The ideal candidate will have extensive wire bonding leadership experience, deep knowledge of bonding techniques and equipment, and a track record of implementing SOPs and process improvements in a high-volume production

Responsibilities

• Extensive experience in wire bonding operations within the semiconductor industry, with a proven track record of leadership.
• In-depth knowledge of various wire bonding techniques and equipment.
• Set up and operate wire bonding equipment according to established procedures.
• Lead and manage the wire bond team, providing guidance, coaching, and support.
• Foster a collaborative and high-performance work environment within the wire bonding department.
• Conduct inspections of wire bonds to ensure they meet quality standards and specifications.
• Troubleshoot and resolve issues related to wire bonding processes, collaborating with CFT teams when necessary to enhance efficiency, quality and yield.
• Maintain accurate records of production activities, including process parameters, equipment settings, and quality control data.
• Contribute to the creation and updating of standard operating procedures (SOPs) related to wire bonding processes.
• Collaborate with engineering teams to implement improvements and innovations in wire bonding technology.
• Establish and enforce quality control measures for wire bonding operations.
• Ensure compliance with industry standards and customer specifications.
• Perform routine maintenance on wire bonding equipment to ensure optimal functionality.
• Develop and implement strategic plans for the wire bonding department in alignment with overall organizational goals.
• Identify opportunities for cost savings, productivity enhancements, and technological advancements.
• Collaborate with other department heads, including engineering, production, and quality assurance, to achieve seamless integration of processes.
• Communicate effectively with stakeholders to address challenges and optimize workflows.
• Identify and address skill gaps within the team.
• Ensure accurate documentation of wire bonding processes, equipment settings, and quality control data.
• Communicate effectively with team members to address issues and drive continuous improvement.
• Generate reports on departmental performance and key metrics.

Job description

Job Description:

• Extensive experience in wire bonding operations within the semiconductor industry, with a proven track record of leadership.
• In-depth knowledge of various wire bonding techniques and equipment.
• Set up and operate wire bonding equipment according to established procedures.
• Lead and manage the wire bond team, providing guidance, coaching, and support.
• Foster a collaborative and high-performance work environment within the wire bonding department.
• Conduct inspections of wire bonds to ensure they meet quality standards and specifications.
• Troubleshoot and resolve issues related to wire bonding processes, collaborating with CFT teams when necessary to enhance efficiency, quality and yield.
• Maintain accurate records of production activities, including process parameters, equipment settings, and quality control data.
• Contribute to the creation and updating of standard operating procedures (SOPs) related to wire bonding processes.
• Collaborate with engineering teams to implement improvements and innovations in wire bonding technology.
• Establish and enforce quality control measures for wire bonding operations.
• Ensure compliance with industry standards and customer specifications.
• Perform routine maintenance on wire bonding equipment to ensure optimal functionality.
• Develop and implement strategic plans for the wire bonding department in alignment with overall organizational goals.
• Identify opportunities for cost savings, productivity enhancements, and technological advancements.
• Collaborate with other department heads, including engineering, production, and quality assurance, to achieve seamless integration of processes.
• Communicate effectively with stakeholders to address challenges and optimize workflows.
• Identify and address skill gaps within the team.
• Ensure accurate documentation of wire bonding processes, equipment settings, and quality control data.
• Communicate effectively with team members to address issues and drive continuous improvement.
• Generate reports on departmental performance and key metrics.

Requirements: