IC Technology Development - Mold Process Engineer

Tata Electronics Limited; Vemagal; On-site; INR 1,500,000 - 2,200,000; Full time

Job summary

Tata Electronics Limited is seeking an IC Technology Development - Mold Process Engineer to introduce and maintain EOL assembly processes across molding, laser marking, singulation, and wire bonding. You will ensure manufacturing and quality requirements are met and drive improvements in process efficiency and yield.

The role requires hands-on experience in FOL/EOL within the semiconductor industry, strong leadership to guide the wire bond team, and collaboration with cross-functional teams to

Qualifications

• Bachelor's degree in Mechanical, Electronics or Electrical Engineering.
• Hands-on experience in FOL or EOL process within semiconductor industry.
• Ability to set up and operate FOL or EOL equipment.
• Ability to lead wire bond team and drive continuous improvement.

Responsibilities

• Lead and manage the wire bond team.
• Set up and operate FOL or EOL equipment.
• Inspect wire bonds to meet quality standards.
• Develop and update SOPs for wire bonding processes.
• Collaborate with program manager and deliver reports on time.
• Identify opportunities for cost savings and productivity improvements.
• Maintain production records and process parameters.

Skills

Wire bonding

Process troubleshooting

Team leadership

Analytical skills

Communication

Education

Bachelor's degree in Mechanical/Electrical/Electronics Engineering

Tools

FOL/EOL equipment

Wire bonding equipment

Job description

IC Technology Development - Mold Process Engineer

About the Role

Introduce and maintain EOL (Moulding, Laser marking, Singulation and Wire bond) Assembly processes and activities to ensure the requested requirements from manufacturing and quality are achieved.

Key Responsibilities

• Handson experience in FOL or EOL process within semiconductor industry, with a proven track record of accomplishment.
• In-depth knowledge of any single /multiple process related to process and equipment.
• Set up and operate FOL or EOL equipment according to established procedures.
• Lead and manage the wire bond team, providing guidance, coaching, and support.
• Foster a collaborative and high-performance work environment within the department.
• Conduct inspections of wire bonds to ensure they meet quality standards and specifications.
• Troubleshoot and resolve issues related to process or equipment, collaborating with CFT teams when necessary to enhance efficiency, quality and yield.
• Maintain accurate records of production activities, including process parameters, equipment settings, and quality control data.
• Contribute to the creation and updating of standard operating procedures (SOPs) related to wire bonding processes.
• Collaborate with program manager and deliver reports on time.
• Establish and enforce quality control measures for wire bonding operations.
• Ensure compliance with industry standards and customer specifications.
• Develop and implement strategic plans for the wire bonding department in alignment with overall organizational goals.
• Identify opportunities for cost savings, productivity enhancements, and technological advancements.
• Collaborate with other department heads, including engineering, production, and quality assurance, to achieve seamless integration of processes.
• Communicate effectively with stakeholders to address challenges and optimize workflows.
• Identify and address skill gaps within the team.
• Ensure accurate documentation of wire bonding processes, equipment settings, and quality control data.
• Communicate effectively with team members to address issues and drive continuous improvement.
• Generate reports on departmental performance and key metrics.
• Strong analytical and problem‑solving skills
• Excellent communication and interpersonal skills.
• Demonstrated ability to lead and motivate a diverse team.

Qualifications

• Bachelor’s degree in mechanical, Electronics or Electrical Engineering.