Process Engineer SME

Tata Electronics; Assam; On-site; INR 1,200,000 - 1,800,000; Full time

Job summary

Tata Electronics in India is seeking a highly experienced engineer to support equipment and process set-up, perform troubleshooting, and drive improvements in MTBA, OEE, MTBF and MTTR. The role covers major conversions, device setup, downtime management, and 5S maintenance across multiple semiconductor packaging lines.

The candidate should have a Bachelor’s degree in Mechanical, Materials, Electronics Engineering or related field and 15+ years of relevant experience, with strong problem-solving

Qualifications

• Bachelor’s degree in Mechanical, Materials, Electronics Engineering or related field.
• 15+ years working experience, preferably in FOL processes of Semiconductor packaging.
• Strong problem-solving and cross-functional collaboration skills.

Responsibilities

• Support equipment and process set-up and PM activities.
• Troubleshoot to meet MTBA, OEE, MTBF and MTTR targets.
• Perform breakdown troubleshooting and monitor performance after repair or upgrade.
• Manage downtime and update shift downtime for listed process equipment.
• Lead major conversions and device setup, resolving daily issues.
• Conduct root cause analysis and process mapping for line quality issues.
• Issue spare parts and track stock/non-stock parts; trigger purchases.
• Equipment wiring management and 5S in the area.
• Ensure proper pass-over shift communication and follow-up.
• Participate in mentor/vendor training to upgrade skills.
• Ensure spec compliance and follow OCAP for machine troubleshooting
• Act as ERT shift representative for equipment and process

Skills

Troubleshooting

PM activities

Root cause analysis

Cross-functional collaboration

Equipment maintenance

5S/housekeeping

Education

Bachelor’s degree in Mechanical, Materials, Electronics Engineering

Tools

Semiconductor packaging equipment

Job description

Job Description:

Responsibilities:

• 1. Support equipment and process set-up. Support PM group for PM activities where necessary.

• 2. Involve in troubleshooting activity and ensure completion within theallocatedtime to meet the targeted MTBA, OEE, MTBF and MTTR.

• 3. Perform troubleshooting for daily breakdown machine and monitor machine performance after repair, installation, upgrade & modification. Achieve/meet target of minimum downtime and update shift downtime for all process equipment in ASM WB, ShinkawaWB ,KaijoWB ,KNS WB, KNS Wedge bonder, Royce write Pull Ball Shear, Plasma process, etc.

• 4. Perform and involve in Major Conversion, change device setup, resolving day-to-day issues, provide detailed information to superiors on any encounter issue which lead to a high equipment downtime.

• 5. Perform root cause analysis and process mapping for line quality issue; implement containment actions and feedback to superiors for further actions. Update shift report to respective Team.

• 6. Issuing spare parts for stock items, keep track qty for non-stock items/critical parts and trigger superior topurchaseif reach triggering limit.

• 7. Perform equipment wiring management andmaintainprocess area/machine 5S in mentioned area.

• 8. Proper Passover shift communication, information sharing & follow up.

• 9. Go through internal mentor program/vendor training to upgrade technical skill

• 10. Ensure spec compliance and follow OCAP for machine troubleshooting

• 11 Act as ERT shift representative for mention equipment and process

Education:

• Bachelor’sdegree in Mechanical, Materials, ElectronicsEngineeringor a related field.

Experience & Skill:

• Minimum 15years of working experienceand, preferably inFOLprocessesof Semiconductor packaging.

• Proven experience in process optimization, problem-solving, and cross-functional collaboration.

• Good Hands-on skill in the mentioned equipment and must be responsible to reduce downtime effectively.

Requirements: