Slicing Process Engineering - Wafer

Skillventory; Jamnagar; On-site; INR 800,000 - 1,200,000; Full time

Job summary

Skillventory in Jamnagar, India, seeks a Mechanical Process Engineer to monitor and control Diamond Wire Slicing processes, ensuring silicon wafers meet thickness, TTV, bow, warp, and surface quality specs.

You will analyze process data to drive yield, productivity and cost improvements, troubleshoot abnormalities, and collaborate with Production, Quality, Maintenance and R&D to implement upgrades and SOPs for sustained performance. This role emphasizes safety, quality, and ISO compliance.

Qualifications

• Must have background in designing, implementing and optimizing industrial processes in manufacturing.
• Experience with statistical methods and data analysis is essential.
• Familiarity with ISO standards and Six Sigma methodologies is preferred.

Responsibilities

• Monitor and control Diamond Wire Slicing processes to ensure wafers meet thickness, TTV, bow, warp, and surface quality specs.
• Analyze process performance data to identify yield, productivity, wire consumption, and cost optimization opportunities.
• Support process optimization initiatives through experimentation, data analysis, and process improvements.
• Investigate and troubleshoot process abnormalities including wafer breakage, wire marks, thickness variation, edge chipping, and kerf loss.
• Collaborate with Production, Quality, Maintenance, and R&D teams to resolve process challenges and implement upgrades.
• Monitor key process parameters such as wire speed, feed rate, tension, coolant/slurry, slicing time, and consumables usage for stability.
• Develop, update, and maintain SOPs, Work Instructions, Control Plans, and Process Flow Diagrams.
• Support process validation, qualification, and trial activities for new equipment, consumables, wire specs, and process changes.
• Participate in continuous improvement projects focused on wafer quality, cycle time reduction, and manufacturing cost reduction.
• Ensure compliance with safety, environmental, quality, and ISO standards across slicing activities.
• Work with equipment engineers to improve reliability and preventive maintenance effectiveness.
• Assist operator training and provide technical guidance.
• Prepare technical reports and present process performance metrics including yield, productivity, quality trends, consumable usage, and improvement results.

Skills

Industrial process engineering

Data analysis

Six Sigma

SPC

Problem solving

Communication skills

ISO knowledge

Education

B.E./B.Tech in Mechanical Engineering

Tools

Minitab

Microsoft Office

Job description

Role & responsibilities

• Monitor and control Diamond Wire Slicing processes to ensure consistent production of silicon wafers meeting defined thickness, TTV, bow, warp, and surface quality specifications.
• Analyze process performance data and identify opportunities for yield improvement, productivity enhancement, wire consumption reduction, and cost optimization.
• Support process optimization initiatives through experimentation, data analysis, and implementation of process improvements.
• Investigate and troubleshoot process abnormalities including wafer breakage, wire marks, thickness variation, edge chipping, excessive kerf loss, and equipment-related issues.
• Collaborate with Production, Quality, Maintenance, and R&D teams to resolve process challenges and implement new technologies or process upgrades.
• Monitor key process parameters including wire speed, feed rate, tension, coolant/slurry parameters, slicing time, and consumable usage to ensure process stability.
• Conduct Root Cause Analysis (RCA) and implement Corrective and Preventive Actions (CAPA) for process deviations and quality issues.
• Develop, update, and maintain process documentation including SOPs, Work Instructions, Control Plans, Process Flow Diagrams, and troubleshooting guides.
• Support process validation, qualification, and trial activities for new equipment, consumables, wire specifications, and process changes.
• Participate in continuous improvement projects focused on wafer quality improvement, cycle time reduction, OEE improvement, and manufacturing cost reduction.
• Monitor and improve process capability (Cp/Cpk) through Statistical Process Control (SPC) and data-driven process management.
• Ensure compliance with safety, environmental, quality, and operational standards across all slicing activities.
• Work closely with equipment engineers and maintenance teams to improve equipment reliability, uptime, and preventive maintenance effectiveness.
• Support operator training and skill development by providing technical guidance and process-related coaching.
• Prepare technical reports and present process performance metrics including yield, productivity, quality trends, consumable consumption, and improvement project results.

Preferred candidate profile

• B.E./B.Tech in Mechanical Engineering.
• 2-7 years of relevant experience in industrial process engineering/manufacturing.
• Strong experience in designing, implementing, and optimizing industrial processes in a manufacturing setup.
• Candidates with experience in Diamond Wire Saw / Diamond Wire Slicing processes will be preferred.
• Good understanding of materials such as diamond wire and diamond tools, along with mechanics such as fluid movement and automation involved in silicon wafer manufacturing.
• Experience in Silicon Wafer manufacturing for semiconductor or solar applications will be preferred.
• Candidates from Solar, Semiconductor, Automobile Parts Machining, or other high-tech manufacturing industries will be preferred.
• Strong analytical and problem-solving skills with experience in engineering statistical methods and data analysis.
• Working knowledge of Microsoft Office and Minitab.
• Knowledge of ISO 9001, ISO 14001, ISO 45001, and ISO 50001.
• Knowledge of Six Sigma, QC Tools, Kaizen, Statistical Process Control (SPC), and TQM will be an added advantage.
• Excellent communication and interpersonal skills.