Slicing process Engineering - Wafer

Genxhire Services; Jamnagar; On-site; INR 900,000 - 1,300,000; Full time

Job summary

Genxhire Services in India seeks a process engineer to monitor and optimize Diamond Wire Slicing operations for silicon wafers, ensuring adherence to thickness, TTV, bow, warp, and surface specs. You will analyze data, drive improvements, and collaborate with Production, Quality, Maintenance, and R&D teams to implement upgrades.

The role requires troubleshooting, CAPA implementation, and rigorous documentation, with focus on yield, cycle time, OEE, and cost reduction while maintaining safety and

Responsibilities

• Monitor and control Diamond Wire Slicing processes to ensure silicon wafers meet thickness, TTV, bow, warp, and surface quality specs.
• Analyze process performance data and identify opportunities for yield improvement, productivity enhancement, wire consumption reduction, and cost optimization.
• Support process optimization initiatives through experimentation, data analysis, and implementation of process improvements.
• Investigate and troubleshoot process abnormalities such as wafer breakage, wire marks, thickness variation, edge chipping, excessive kerf loss, and equipment-related issues.
• Collaborate with Production, Quality, Maintenance, and R&D teams to resolve process challenges and implement new technologies or process upgrades.
• Monitor key process parameters including wire speed, feed rate, tension, coolant/slurry parameters, slicing time, and consumable usage to ensure process stability.
• Conduct root cause analysis (RCA) and implement CAPA for process deviations and quality issues.
• Develop, update, and maintain process documentation, including SOPs, Work Instructions, Control Plans, Process Flow Diagrams, and troubleshooting guides.
• Support process validation, qualification, and trial activities for new equipment, consumables, wire specifications, and process changes.
• Participate in continuous improvement projects focused on wafer quality improvement, cycle time reduction, OEE improvement, and manufacturing cost reduction.
• Monitor and improve process capability (Cp/Cpk) through SPC and data-driven process management.
• Ensure compliance with safety, environmental, quality, and operational standards in all slicing activities.
• Work closely with equipment engineers and maintenance teams to improve equipment reliability, uptime, and preventive maintenance effectiveness.
• Support operator training and skill development by providing technical guidance and process-related coaching.
• Prepare technical reports and present process performance metrics including yield, productivity, quality trends, consumable consumption, and improvement project results.

Job description

Role & responsibilities

Preferred candidate profile

Role & responsibilities:

• Monitor and control Diamond Wire Slicing processes to ensure consistent production of silicon wafers meeting thickness, TTV, bow, warp, and surface quality specifications.
• Analyze process performance data and identify opportunities for yield improvement, productivity enhancement, wire consumption reduction, and cost optimization.
• Support process optimization initiatives through experimentation, data analysis, and implementation of process improvements.
• Investigate and troubleshoot process abnormalities such as wafer breakage, wire marks, thickness variation, edge chipping, excessive kerf loss, and equipment-related issues.
• Collaborate with Production, Quality, Maintenance, and R&D teams to resolve process challenges and implement new technologies or process upgrades.
• Monitor key process parameters including wire speed, feed rate, tension, coolant/slurry parameters, slicing time, and consumable usage to ensure process stability.
• Conduct root cause analysis (RCA) and implement corrective and preventive actions (CAPA) for process deviations and quality issues.
• Develop, update, and maintain process documentation, including SOPs, Work Instructions, Control Plans, Process Flow Diagrams, and troubleshooting guides.
• Support process validation, qualification, and trial activities for new equipment, consumables, wire specifications, and process changes.
• Participate in continuous improvement projects focused on wafer quality improvement, cycle time reduction, OEE improvement, and manufacturing cost reduction.
• Monitor and improve process capability (Cp/Cpk) through Statistical Process Control (SPC) and data-driven process management.
• Ensure compliance with safety, environmental, quality, and operational standards in all slicing activities.
• Work closely with equipment engineers and maintenance teams to improve equipment reliability, uptime, and preventive maintenance effectiveness.
• Support operator training and skill development by providing technical guidance and process-related coaching.
• Prepare technical reports and present process performance metrics including yield, productivity, quality trends, consumable consumption, and improvement project results.