Physical Design Engineer - Texas Instruments
About the Role
Join Texas Instruments' Connectivity engineering team as a Physical Design Engineer, where you'll play a critical role in delivering high-performance wireless connectivity solutions that power next-generation IoT, automotive, and industrial applications.
What You'll Do
Physical Implementation
- Floorplanning: Create and optimize chip floorplans to meet performance, power, and area targets
- Placement & Routing: Execute placement optimization and detailed routing for complex SoC designs
- Clock Tree Synthesis (CTS): Design and implement robust clock distribution networks with minimal skew and jitter
- Power Planning: Develop comprehensive power grid strategies including power ring, stripes, and via insertion
- Flow and tool improvements: Work with EDA vendors, TI internal EDA teams to improve flow recipes, implement automations and improve design QoR
Design Verification & Analysis
- Physical Verification: Execute and resolve DRC (Design Rule Check) and LVS (Layout vs. Schematic) violations
- Power management: Execute and verify lower power checks to ensure power management integrity
- Low power implementation: Conduct dynamic and static power analysis to meet power budgets
- Signal Integrity: Address crosstalk, IR drop, and electromigration issues
Design Optimization
- Performance Optimization: Fine-tune design to meet frequency and timing requirements
- Area Optimization: Minimize die size while maintaining functionality and performance
- Yield Enhancement: Implement design-for-manufacturing (DFM) techniques
Collaboration & Documentation
- Cross-functional Collaboration: Work closely with front-end designers, verification teams, and package engineers
- Documentation: Create and maintain comprehensive design documentation and flow methodologies
- Mentorship: Provide guidance to junior engineers and interns
Growth Opportunities
- Work on both established connectivity platforms and breakthrough wireless technologies
- Contribute to multiple tape‑outs annually across different process nodes
- Influence next‑generation connectivity architecture decisions
- Mentorship opportunities with junior engineers and cross‑functional collaboration
Why This Role
- Direct impact on TI's wireless connectivity portfolio performance
- Exposure to diverse wireless standards and emerging technologies
- Opportunity to work with state‑of‑the‑art EDA tools and methodologies
- Be part of innovation initiatives including new wireless technologies for TI
Technical Environment
- Multiple process technology nodes and design rule sets
- Complex mixed-signal connectivity SoC designs
- Automated flow development and optimization