HVAC & Liquid Cooling (AI Data Centers) - SME

HCL Technologies Limited; Mumbai; On-site; INR 6,000,000 - 9,000,000; Full time

Job summary

HCL Technologies Limited seeks a seasoned Subject Matter Expert (HVAC & Liquid Cooling) to shape thermal design for next-generation AI data centers. Lead advanced liquid cooling architectures, CFD modeling, and global validation of 100 kW+ per rack deployments using direct-to-chip, immersion, and hybrid systems.

Requires 12–15+ years in data center thermal engineering with 5+ years in liquid cooling for hyperscale or HPC, and a Master’s/PhD in Mechanical Engineering or related field.

Qualifications

• 12–15+ years in data center HVAC/thermal engineering with at least 5+ years in liquid cooling technologies for hyperscale or HPC environments.
• Domain mastery in direct-to-chip liquid cooling, CDU design, hydronic loop balancing, coolant dynamics, and ASHRAE TC 9.9 standards.
• AI density focus: proven track record designing and validating thermal solutions for 100 kW to 150 kW+ per rack power densities.
• Master’s or Ph.D. in Mechanical Engineering, Thermal Science, or Fluid Mechanics; PE license or Chartered status preferred.

Responsibilities

• Lead design standards for high-density liquid cooling architectures including direct-to-chip, immersion, and CDU systems.
• Perform CFD modeling, hydronic calculations, pressure drop analysis, and thermal capacity planning for GPU clusters.
• Benchmark vendors, validate equipment specs, and review MEP drawings and schematics across global projects.
• Serve as escalation lead for thermal failures, leaks, and CDU performance issues during testing or operations.
• Drive supplier engagement and R&D for next-gen liquid cooling technologies.

Job description

Department: AI Datacenter Design Engineering & Technical Architecture Team

Reports To: Head of Design

Position Overview

We are seeking a top-tier Subject Matter Expert (SME) – HVAC & Liquid Cooling to serve as the ultimate technical authority on thermal engineering, liquid cooling innovation, and HVAC architecture for our next-generation AI data centers.

You will lead the design standards, fluid dynamics modeling, vendor benchmarking, and technical validation for high-density cooling infrastructure. This role is responsible for ensuring our facilities reliably support 100 kW to 150 kW+ per rack GPU deployments using direct-to-chip, immersion, and advanced hydronic cooling loops.

Key Responsibilities

1. 1. Advanced Liquid Cooling Architecture & Innovation
2. Direct-to-Chip & Immersion Topology: Define the global technical standards for direct-to-liquid cold plate loops, single/two-phase immersion cooling, Coolant Distribution Units (CDUs), and Rear Door Heat Exchangers (RDHx).
3. Fluid Dynamics & Thermal Modeling: Lead Computational Fluid Dynamics (CFD) modeling, hydronic network calculations, pressure drop analysis, and thermal capacity planning for high-density GPU clusters (e.g., NVIDIA H100/B200/GB200).
4. Coolant Chemistry & Fluid Management: Establish strict fluid quality guidelines, dielectric/glycol chemical specs, water treatment protocols, filtration standards, and corrosion prevention controls.
5. Primary Heat Rejection Systems: Architect low-PUE primary cooling systems, including magnetic-bearing chillers, adiabatic dry coolers, free-cooling economizers, and cooling towers.
6. Hybrid Air & Liquid Systems: Design balanced thermal environments where liquid cooling handles 80–90%+ of rack heat load while supplementary CRAH/CRAC units maintain ambient data hall humidity and air distribution.
7. Energy & Sustainability Optimization: Drive industry-leading Power Usage Effectiveness (PUE) and Water Usage Effectiveness (WUE) metrics aligned with ASHRAE TC 9.9 liquid cooling guidelines.
8. Design Validation & Review: Perform deep-dive technical reviews of MEP consultant drawings, single-line hydronic schematics, and equipment specifications across all global projects.
9. Root-Cause Failure Analysis: Serve as the escalation lead for complex thermal failures, fluid leaks, pressure drops, or CDU performance degradation during testing or live operations.
10. Vendor Benchmarking & R&D: Evaluate next-gen liquid cooling hardware from global OEMs, pilot emerging cooling technologies, and drive custom equipment engineering with suppliers.

Qualifications & Requirements

Experience: 12–15+ years in data center HVAC/thermal engineering, with at least 5+ years dedicated exclusively to liquid cooling technologies for hyperscale or HPC environments.

Domain Mastery: Recognized authority in direct-to-chip liquid cooling, CDU design, hydronic loop balancing, coolant fluid dynamics, and ASHRAE TC 9.9 standards.

AI Density Focus : Proven track record designing and validating thermal solutions for 100 kW to 150 kW+ per rack power densities.

Education: Master’s or Ph.D. degree in Mechanical Engineering, Thermal Science, or Fluid Mechanics (PE license or Chartered status preferred).

Key Skills : CFD simulation software (6SigmaET / Ansys Fluent), hydronic network modeling, PUE/WUE optimization, failure mode analysis (FMEA), and OEM vendor technical oversight.