IBMS & Structured Cabling Design (AI Data Centers) - SME

HCL Technologies Limited; Mumbai; On-site; INR 2,500,000 - 4,500,000; Full time

Job summary

HCL Technologies Limited in Mumbai seeks an experienced Subject Matter Expert for IBMS, DCIM integration, and high-density fiber cabling to guide global design standards for AI data centers. You will oversee control automation, monitoring networks, and 100 kW+ per rack AI cluster topologies.

The role demands leadership in BMS topology, DCIM platform integration, and optical pathway routing, with focus on reliability, cybersecurity, and OT network performance across hyperscale facilities.

Qualifications

• OT network architecture, DCIM platform integration, fiber insertion loss budgeting, BMS SOO design, and optical pathway routing are required.

Responsibilities

• Design robust BACnet/IP, Modbus, and SNMP control architectures for real-time monitoring of cooling systems.
• Architect high-speed control sequences for liquid cooling and emergency shut-off valves.
• Lead DCIM integration, thermal mapping, dynamic power metering, and leak detection networks.

Skills

OT network architecture

DCIM platform integration

fiber insertion loss budgeting

BMS SOO design

optical pathway routing

Education

Bachelor’s degree in Electrical Engineering, Electronics & Telecommunications, or Computer Engineering

Job description

Job Title: Subject Matter Expert (SME) – IBMS & Structured Cabling Design (AI Data Centers)

Department: : AI Datacenter Design Engineering & Technical Architecture Tea

Reports To: Head of Design

Position Overview

We are seeking an industry-leading Subject Matter Expert (SME) – Integrated Building Management Systems (IBMS) & Structured Cabling Design to serve as the ultimate technical authority for control automation, monitoring networks, and ultra-high-density fiber optic infrastructure across our AI data center portfolio.

You will define global design standards for BMS architecture, DCIM integration, environmental/leak monitoring, and high-speed network cabling. This role ensures our building automation systems seamlessly control critical liquid cooling loops while our structured cabling pathways support massive East-West fabric traffic and 100 kW to 150 kW+ per rack AI cluster topologies.

Key Responsibilities

• Control System Topology: Design robust BACnet/IP, Modbus, and SNMP control architecture for real-time monitoring and automated feedback loops governing Coolant Distribution Units (CDUs), primary chillers, dry coolers, and high-voltage electrical trains.
• Liquid Cooling Control Integration: Architect high-speed automated control sequences, flow balancing algorithms, dynamic pressure differential monitoring, and emergency shut-off valves for direct-to-chip and immersion liquid cooling systems.
• DCIM & Environmental Monitoring: Lead design and integration of Data Center Infrastructure Management (DCIM) platforms, continuous thermal mapping, dynamic power metering, and high-sensitivity water/chemical leak detection networks.

Structured Cabling & Optical Network Engineering

• Ultra-High Density Fiber Design: Architect high-count single-mode and multi-mode optical fiber trunking networks (MPO/MTP connectors, OS2/OM5 fiber) engineered for 400G/800G/1.6T InfiniBand and Ethernet AI fabrics.
• AI Cluster Connectivity: Design intra-hall and inter-hall cable pathways, Main Distribution Areas (MDA), Horizontal Distribution Areas (HDA), and optical patch fields optimized for ultra-dense GPU rack layouts (100 kW to 150 kW+ per rack).
• Physical Pathway Architecture: Specify overhead and underfloor cable tray systems, optical raceways, fire-stopping penetrations, and pathway segregation protocols to prevent thermal obstruction and signal degradation.
• Design Validation: Perform deep-dive peer reviews of low-voltage drawings, IBMS network schematics, software integration logic, and telecommunications cabling layouts developed by MEP design consultants.
• Industry Compliance: Enforce strict adherence to TIA-942, ISO/IEC 11801, BICSI data center standards, and cybersecurity protocols for operational technology (OT) networks.
• Failure Analysis & Escalation: Act as the escalation lead for IBMS network latency failures, sensor calibration errors, optical insertion loss issues, or BMS/DCIM telemetry gaps during commissioning or live operations.

Qualifications & Requirements

• Experience:12–15+ years in data center low-voltage, automation, and telecommunications engineering, with at least 5+ years as a lead designer/SME for hyperscale facilities.
• Domain Mastery: Technical authority in BMS/DCIM protocols (BACnet, Modbus, SNMP), high-density fiber optronics (MTP/MPO 400G+), liquid cooling control integration, and continuous leak detection.
• AI Workload Focus: Proven track record designing IBMS telemetry and structured cabling for 100 kW to 150 kW+ rack densities and high-density GPU fabric clusters.
• Education & Credentials: Bachelor’s degree in Electrical Engineering, Electronics & Telecommunications, or Computer Engineering (RCDD or DCDC certification highly preferred).
• Key Skills: OT network architecture, DCIM platform integration, fiber insertion loss budgeting, BMS sequence of operations (SOO) design, and optical pathway routing