High-Speed PCB Simulation Manager

Grafton Recruitment India

Bengaluru

On-site

INR 3,500,000 - 5,500,000

Full time

14 days+

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Job summary

Grafton Recruitment India in Bengaluru seeks a Senior High-Speed PCB Simulation Manager to lead a dedicated SI/PI/EMC/Thermal team, guiding end-to-end simulation from concept to production while optimizing cost and quality. You will mentor engineers, drive design validation, and ensure high-speed interfaces such as DDR and PCIe meet performance and reliability targets.

You will work with tools like Ansys SIwave/HFSS, Keysight ADS/SIPro, HyperLynx, Cadence Sigrity, CST Studio and

Qualifications

  • Strong expertise in SI, PI, EMC/RFI, and Thermal analysis.
  • Around 10+ years of hands-on experience in high-speed PCB simulation.
  • Experience with high-speed interfaces like DDR/PCIe.
  • Expertise with simulation tools for high-speed electrical and thermal analysis.
  • Hands-on with tools such as Ansys SIwave/HFSS, Keysight ADS/SIPro, HyperLynx, Cadence Sigrity, CST Studio, ICEPAK/FLOTHERM/Celsius.
  • Exposure to PCB design/layout environments: Allegro/Altium/PADS.
  • Working knowledge of IPC/JEDEC/PCIe/USB/Ethernet standards.

Responsibilities

  • Lead and mentor a PCB simulation team, driving end-to-end simulation and design validation from concept to mass production.
  • Optimize cost and quality while ensuring designs meet performance and manufacturability targets.

Skills

Signal Integrity
Power Integrity
EMC/RFI
Thermal analysis
Team leadership
PCB simulation
High-speed interfaces

Tools

Ansys SIwave/HFSS
Keysight ADS/SIPro
Siemens HyperLynx
Cadence Sigrity
CST Studio
ICEPAK / FLOTHERM / Celsius
Allegro
Altium
PADS

Job description

Hiring for a globally trusted leader in connectivity & sensor solution.

High-Speed PCB Simulation Manager (SI/PI/EMC/Thermal)

Location: Bangalore | Experience: 12+ years & Team management (3+ Yrs.)

Role Overview

This is a senior leadership position to lead and mentor a PCB simulation team, driving end-to-end simulation and design validation to ensure high-speed PCB designs meet performance, reliability, and manufacturability targets from concept through prototyping to mass production, with strong focus on cost and quality optimization.

Key Requirements
  • Strong expertise in Signal Integrity (SI), Power Integrity (PI), EMC/RFI, and Thermal analysis
  • Around 10+ Yrs of extensive hands-on experience in high-speed PCB simulation
  • Experience with high-speed interfaces such as DDR/PCIe
  • Expertise with simulation tools for high-speed electrical and thermal analysis
  • Hands-on with tools such as Ansys SIwave/HFSS, Keysight ADS/SIPro, Siemens HyperLynx, Cadence Sigrity, CST Studio, ICEPAK / FLOTHERM / Celsius
  • Exposure to PCB design/layout environments: Allegro / Altium / PADS
  • Working knowledge of standards: IPC, JEDEC, PCIe, USB, Ethernet
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