SR MGR R&D/PRODUCT DVL ENGINEERING - PCB Design and Simulation

TE Connectivity; Bengaluru; On-site; INR 1,800,000 - 2,300,000; Full time

Job summary

TE Connectivity is seeking a Senior Manager for R&D/Product Development Engineering focusing on PCB Design and Simulation in Bengaluru, India. This role involves leading teams in delivering high-performance PCB solutions for AI and datacenter applications. Candidates should have a rich experience in high-speed PCB design and a strong ability to manage multi-functional teams.

The ideal candidate will possess a strong technical background coupled with leadership skills, ensuring project success through collaboration and innovation. A bachelor's degree in electrical engineering and extensive experience in PCB design are required.

Qualifications

• 20 years extensive hands‑on experience in high‑speed PCB design/simulation.
• 8-10 years progressive leadership in developing high‑performing teams.
• Deep understanding of engineering principles for high‑speed PCB design.

Responsibilities

• Lead and develop teams of PCB design and simulation engineers.
• Define and implement methodologies for signal integrity and power integrity.
• Oversee multiple complex PCB design projects to meet performance targets.

Skills

High-speed PCB design

Signal integrity (SI)

Power integrity (PI)

Electromagnetic compatibility (EMC)

Project management

Team leadership

PCB design tools (Altium, Allegro)

Communication Skills

Education

Bachelor's degree in electrical or electronics engineering

Master's degree in a related field

Tools

Ansys SIwave

Cadence Sigrity

Altium Designer

Job description

SR MGR R&D/PRODUCT DVL ENGINEERING - PCB Design and Simulation

Job Overview

Digital Data & Networks (DDN) Business Unit in TE Connectivity, where we enable high‑speed connectivity solutions that power today’s and tomorrow’s data‑driven world. The engineering team is responsible for the development of innovative interconnect solution products which are used in hyperscale computers, AI, datacenter, cloud server, and other IT systems, including connector, cable assembly, bus bars and sockets. We engineer and manufacture cutting‑edge interconnect solutions that support high‑speed data transmission, signal integrity, and power efficiency.

Role Objective

Sr. Manager is a senior engineering leader for high‑speed PCB Design and Simulations. They lead teams in designing, simulating, and validating high‑performance high‑speed printed circuit boards for AI and datacenter applications ensuring quality, performance, and manufacturability through strategic planning, technical guidance, and collaboration across cross‑functional teams. Responsibilities include team development, design and simulation strategy, project management, and continuous process improvement to meet deadlines, budget targets, and project performance goals.

Responsibilities

• Team Leadership & Development: Lead, mentor, and develop teams of high‑speed PCB design and simulation managers and engineers, focusing on their career growth and skill development.
• Strategic Design and Simulation: Define and implement high‑speed design and simulation roadmaps, methodologies and best practices for signal integrity, power integrity, electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal analysis.
• Cross‑Functional Collaboration: Work closely with hardware, firmware, mechanical, and manufacturing teams to translate requirements into viable designs and resolve issues.
• Project & Resource Management: Oversee the management of multiple complex PCB design and simulation projects, ensuring they meet deadlines, budget requirements, and performance targets.
• Technical Oversight: Provide technical guidance on PCB layout, schematic creation, and component selection, staying current with new technologies and design standards.
• Design Review and Verification: Conduct design and simulation reviews, providing strategic recommendations to optimize PCB performance and reliability.
• Continuous Improvement: Drive innovation and improvement in high‑speed PCB design and simulation process. Stay current with emerging technologies, design standards (e.g. IPC), and simulation tools to enhance efficiency and maintain a competitive edge.
• Quality and Validation: Lead and drive accuracy in design and simulations, conduct design of experiments (DoE), plausibility check and sensitivity study of simulations, validate simulation results with experimental data, and design optimizations for first‑time‑right manufacturability (prototypes and mass production).

Candidate Desired Profile

Education

A bachelor’s degree in electrical or electronics engineering from a premier institute/university. A master’s degree in a related field is preferred.

Experience

20 years extensive hands‑on experience in high‑speed PCB design/simulation (SI/PI/EMI/EMC) with a proven track record of delivering complex projects.

Leadership

8-10 years progressive leadership or management experience in leading and developing high‑performing engineering teams. Experience in customer engagement and stakeholder management is essential.

Technical Skills

• Deep understanding of engineering principles for high‑speed PCB design, signal integrity (SI), power integrity (PI), electromagnetic compatibility (EMC), radio frequency interference (RFI) and thermal incidents.
• Deep understanding of PCB layout, schematic creation, routing, and manufacturability.
• Expertise in high‑speed PCB design tools such as Altium Designer, Allegro or PADS.
• Expertise in high‑speed PCB simulation tools for electrical and thermal analysis - Ansys SIwave/HFSS, Keysight Pathwave ADS, Keysight SIPro, Siemens HyperLyx, Cadence Sigrity, Dassault CST Studio Suite, Ansys EMC Plus, Cadence Microwave Office, and Ansys ICEPAK/Siemens FLOTHERM/Cadence CELSIUS.
• Strong knowledge of industry standards (IPC, JEDEC, PCIe, USB, Ethernet) and PCB manufacturing processes, including design for manufacturability (DFM).

Soft Skills

• Proven abilities on inspiring leadership, team management, prioritisation, strategy and execution.
• Experience in organizational development, and talent attraction/management/retention.
• Promote and manage employee wellbeing and work‑life balance.
• Passion for technology and scientific/engineering excellence.
• Excellent problem‑solving and analytical skills to resolve complex technical issues.
• Strong in technical documentations, report preparation and presentation.
• Strong verbal and written communication skills to articulate complex technical concepts to both technical and non‑technical stakeholders.
• Ability to work effectively in a fast‑paced, collaborative global environment and global time zones.
• Proficient using MS Office software (Word, Excel, PowerPoint, Outlook, Teams, etc.).

What your background should look like

Generally requires Bachelor's degree in appropriate field with 12 or more years of experience; or Master’s with 10 or more years of experience; or PhD level with 6 or more years of experience; or local equivalent.