Design Engineering Architect

Cadence

Bengaluru

On-site

INR 4,000,000 - 6,000,000

Full time

2 days ago
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Job summary

Cadence invites applications for a Sr Principal SI/PI Engineer to join the HPP IP R&D Group in Bengaluru, India. This hands-on role focuses on high-speed IP products, DR/PI optimization, and collaboration with chip designers and customers.

You will lead SI/PI design verification, develop channel models, and provide feedback on packaging and PCB guidelines. Strong lab skills and expert communication are essential.

Qualifications

  • MS or Ph.D. in Electrical Engineering (or similar degree).
  • 15+ years of experience in high speed SerDes and PHYs.
  • Strong understanding of high speed SerDes architecture.
  • Hands-on lab experience with instruments like high speed oscilloscopes, TDRs, VNAs, spectrum analyzers, etc.
  • Fluent with 3D and 2.5D extraction tools like Sigrity Clarity/PowerSI or Ansys HFSS/SIwave.
  • Experience with IBIS-AMI model simulations.
  • Experience with simulation result to lab measurement correlation.
  • Strong understanding of PCB and FCBGA design rules and requirements.
  • Strong debugging and problem-solving skills.
  • Excellent communication and presentation skills to effectively communicate with both customers and internal stake holders

Responsibilities

  • Work on test chip package design SI/PI optimization and verification.
  • Work on evaluation board design optimization for best SI/PI performance.
  • Provide extracted and measured channel models for chip designers in the R&D team.
  • Help with package and PCB SI/PI design guidelines and customer support on SI/PI related inquiries.
  • Review customer package and board designs and simulation results. Help with providing feedback to customers to ensure best possible performance of our IP in their ASIC.
  • Work on link performance simulations using S-parameter channel models and IBIS-AMI behavioral models.
  • Help with SI/PI related debug of test chips or customer ASICs in the lab.

Skills

High speed SerDes
PCB design
Lab instrumentation
Communication skills

Education

MS or PhD in Electrical Engineering

Tools

Sigrity Clarity/PowerSI
Ansys HFSS/SIwave
Oscilloscopes
TDRs / VNAs

Job description

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

JOb Profile

This is a unique opportunity to join the HPP IP R&D Group at Cadence Design Systems. We are looking for a Sr Principal SI/PI Engineer who will be a key contributor to our advanced high speed IP products. This is a hands-on technical position.

Main Job Tasks And Responsibilities
  • Work on test chip package design SI/PI optimization and verification.
  • Work on evaluation board design optimization for best SI/PI performance.
  • Provide extracted and measured channel models for chip designers in the R&D team.
  • Help with package and PCB SI/PI design guidelines and customer support on SI/PI related inquiries.
  • Review customer package and board designs and simulation results. Help with providing feedback to customers to ensure best possible performance of our IP in their ASIC.
  • Work on link performance simulations using S-parameter channel models and IBIS-AMI behavioral models.
  • Help with SI/PI related debug of test chips or customer ASICs in the lab.
Position Requirements
  • M.S. or Ph.D. Electrical Engineering (or similar degree)
  • 15+ years of experience preferably working with high speed SerDes and PHYs
  • Good understanding of high speed SerDes architecture
  • Hands on lab experience with instruments like high speed oscilloscopes, TDRs, VNAs, spectrum analyzers, etc.
  • Fluent with using 3D and 2.5D extraction tools like Sigrity Clarity/PowerSI or Ansys HFSS/SIwave
  • Experience with IBIS-AMI model simulations
  • Experience with simulation result to lab measurement correlation
  • Good understanding of PCB and FCBGA design rules and requirements
  • Strong debugging and problem-solving skills
  • Excellent communication and presentation skills to effectively communicate with both customers and internal stake holders

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