Principal Engineer, AMS Circuit Design – High-Speed SerDes

Mulya Technologies; Hyderabad; On-site; INR 1,800,000 - 2,400,000; Full time

Job summary

Mulya Technologies in Hyderabad is seeking an experienced Staff/Principal Engineer for Analog/Mixed-Signal Design in high-speed SerDes. You will own circuits from architecture to silicon, lead design reviews, and mentor junior engineers in a small, hands-on team with direct impact on product decisions.

The role requires delivering end-to-end design blocks, collaborating with architecture, SI/package, DSP, and verification teams, and supporting silicon bring-up and lab characterization.

Qualifications

• MS or PhD in Electrical Engineering (or equivalent) and 8+ years in analog/mixed-signal IC design.
• High-speed SerDes or I/O circuits taken to production silicon in advanced FinFET nodes.
• Hands-on with Synopsys or Cadence custom IC design and simulation flows, including post-layout simulation.

Responsibilities

• Own the design of high-speed analog/mixed-signal blocks for SerDes PHYs, from specification to post-layout sign-off.
• Contribute across transmitter, receiver, clocking, and supporting circuits.
• Derive block-level specifications and budgets for jitter, noise, linearity, power, and area with architecture team.
• Verify designs across PVT corners, Monte Carlo, and extracted parasitics; perform EM/IR and reliability checks.
• Guide layout engineers on floorplanning, matching, and critical routing.
• Partner with SI/package, DSP, digital, and verification teams on calibration and lab bring-up; provide models for system-level sim.

Skills

8+ years analog/mixed-signal design

block ownership

clear communicator

lab bring-up

Education

MS or PhD in Electrical Engineering

Tools

Cadence

Synopsys

Post-layout simulation

Job description

Staff / Principal Engineer, Analog/Mixed-Signal Design – High-Speed

SerDes

About the Team

Stealth mode start-up

We are an early-stage engineering team building high-bandwidth, low-power interconnect for next- generation compute and datacenter systems, spanning die-to-die links and 224G-class electrical SerDes.

We are looking for an experienced analog/mixed-signal designer to take ownership of key circuits in our PHYs and help carry them from architecture through silicon. This is a small, hands-on team: you will own your blocks end to end, from specification and design through layout, tapeout, and lab bring-up, and have a direct say in architecture and product decisions.

What You'll Be Doing

• Own the design of one or more high-speed analog/mixed-signal blocks for our SerDes PHYs, from specification and architecture through schematic design, simulation, and post-layout sign-off.
• Contribute across the PHY, including transmitter (serializer, driver, DAC-based TX, FFE), receiver (CTLE, DFE, samplers, ADC-based front end), clocking (PLL/DLL, phase interpolator, duty-cycle correction, CDR or forwarded clock), and supporting circuits (termination, deskew, bias, references).
• Derive block-level specifications and budgets for jitter, noise, linearity, power, and area from link-level requirements, working closely with the architecture team.
• Verify designs across PVT corners, Monte Carlo, and extracted parasitics, including EM/IR and reliability checks.
• Guide layout engineers on floorplanning, matching, and critical routing.
• Partner with SI/package, DSP, digital, and verification teams on calibration, link training, and adaptation, and provide behavioral models for system-level simulation.
• Support silicon bring-up, lab characterization, and debug.
• Lead design reviews and mentor junior engineers.

What We Need to See

• MS or PhD in Electrical Engineering (or equivalent) and 8+ years in analog/mixed-signal IC design.
• High-speed SerDes or I/O circuits taken to production silicon in advanced FinFET nodes.
• Strong fundamentals in noise, jitter, equalization, and clocking.
• Hands‑on with Synopsys or Cadence custom IC design and simulation flows, including post‑layout simulation.
• Clear communicator across architecture, digital, and package teams.
• Comfortable owning your blocks end to end in a small team, lab work included.

Ways to Stand Out from the Crowd

• Experience with 112G/224G PAM4 SerDes, including ADC/DSP-based receivers or DAC-based
• Experience with die-to-die interconnect standards such as UCIe.
• Familiarity with advanced packaging and package/interposer signal integrity.
• Experience with calibration and adaptation loops and mixed-signal co-design.
• Python, SKILL, or similar scripting to automate simulation, regression, and data analysis, including AI/LLM-based agents applied to design workflows.
• Hands‑on silicon bring-up and lab characterization experience.