Staff Engineer, AMS circuit Design – High-Speed SerDes

Mulya Technologies

Bengaluru

On-site

INR 4,000,000 - 9,000,000

Full time

5 days ago
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Job summary

Mulya Technologies in Bengaluru is seeking an experienced Staff/Principal Engineer to own high-speed analog/mixed-signal blocks for SerDes PHYs. You will drive architecture, schematic design, and post-layout sign-off, working closely with architecture and layout teams.

You will lead design reviews, mentor juniors, and support silicon bring-up, lab characterization, and debugging, from specification through tapeout in a small, hands-on team.

Qualifications

  • MS or PhD in Electrical Engineering with 8+ years in analog/mixed-signal IC design.
  • Experience taking high-speed SerDes/I/O circuits to production silicon on advanced FinFET nodes.
  • Strong fundamentals in noise, jitter, clocking, and equalization.
  • Hands-on with custom IC design and simulation flows (Synopsys/Cadence) including post-layout simulation.
  • Clear communicator across architecture, digital, and packaging teams.
  • Willingness to own blocks end-to-end in a small team including lab work.

Responsibilities

  • Own end-to-end design of high-speed analog/mixed-signal blocks for SerDes PHYs.
  • Collaborate across transmitter/receiver/clocking and supporting circuits.
  • Derive spec budgets for jitter, noise, power and area from link-level requirements.
  • Verify designs across PVT corners and parasitics.
  • Guide layout engineers on floorplanning and routing.
  • Partner with SI/package, DSP, digital, and verification teams on calibration and models.
  • Support silicon bring-up, lab characterization and debug.
  • Lead design reviews and mentor junior engineers.

Skills

Analog design
High-speed SerDes
Silicon tapeout
PVT simulation

Education

MS/PhD in Electrical Engineering

Tools

Synopsys
Cadence

Job description

Staff / Principal Engineer, Analog/Mixed-Signal Design – High-Speed

SerDes

About the Team

Stealth mode start-up

We are an early-stage engineering team building high-bandwidth, low-power interconnect for next- generation compute and datacenter systems, spanning die-to-die links and 224G-class electrical SerDes.

We are looking for an experienced analog/mixed-signal designer to take ownership of key circuits in our PHYs and help carry them from architecture through silicon. This is a small, hands-on team: you will own your blocks end to end, from specification and design through layout, tapeout, and lab bring-up, and have a direct say in architecture and product decisions.

What You'll Be Doing
  • Own the design of one or more high-speed analog/mixed-signal blocks for our SerDes PHYs, from specification and architecture through schematic design, simulation, and post-layout sign-off.
  • Contribute across the PHY, including transmitter (serializer, driver, DAC-based TX, FFE), receiver (CTLE, DFE, samplers, ADC-based front end), clocking (PLL/DLL, phase interpolator, duty-cycle correction, CDR or forwarded clock), and supporting circuits (termination, deskew, bias, references).
  • Derive block-level specifications and budgets for jitter, noise, linearity, power, and area from link-level requirements, working closely with the architecture team.
  • Verify designs across PVT corners, Monte Carlo, and extracted parasitics, including EM/IR and reliability checks.
  • Guide layout engineers on floorplanning, matching, and critical routing.
  • Partner with SI/package, DSP, digital, and verification teams on calibration, link training, and adaptation, and provide behavioral models for system-level simulation.
  • Support silicon bring-up, lab characterization, and debug.
  • Lead design reviews and mentor junior engineers.
What We Need to See
  • MS or PhD in Electrical Engineering (or equivalent) and 8+ years in analog/mixed-signal IC design.
  • High-speed SerDes or I/O circuits taken to production silicon in advanced FinFET nodes.
  • Strong fundamentals in noise, jitter, equalization, and clocking.
  • Hands‑on with Synopsys or Cadence custom IC design and simulation flows, including post‑layout simulation.
  • Clear communicator across architecture, digital, and package teams.
  • Comfortable owning your blocks end to end in a small team, lab work included.
Ways to Stand Out from the Crowd
  • Experience with 112G/224G PAM4 SerDes, including ADC/DSP-based receivers or DAC-based
  • Experience with die-to-die interconnect standards such as UCIe.
  • Familiarity with advanced packaging and package/interposer signal integrity.
  • Experience with calibration and adaptation loops and mixed-signal co-design.
  • Python, SKILL, or similar scripting to automate simulation, regression, and data analysis, including AI/LLM-based agents applied to design workflows.
  • Hands‑on silicon bring-up and lab characterization experience.
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