Senior Staff Engineer — Lead Molding & Final Test Ops

Infineon Technologies; Batam; On-site; IDR 400,000,000 - 800,000,000; Full time

Job summary

Infineon Technologies in Batam, Indonesia, is seeking a Senior Staff/Principal Engineer for Molding, Mark, Trim & Form, Die Attach, Clip Attach, and Final Test, Scan & Pack (SON Package) in our Manufacturing and Operations team.

You will lead engineering activities, drive process optimization to improve test yield, quality, productivity, and cost, and supervise process and equipment qualification and characterization in a high-tech cleanroom environment.

Qualifications

• Bachelor's/Master's/PhD in Engineering or related field.
• Minimum 10 years semiconductor manufacturing experience.
• Experience with molding, marking, form, die attach, clip attach, final test, scan and pack processes.

Responsibilities

• Lead molding/mark, trim & form, die attach, clip attach, and final test, scan and pack for SON product.
• Drive process optimization to improve test yield, quality, productivity, equipment utilization and cost.
• Lead process and equipment qualification and process characterization.

Skills

Leadership

Project management

Troubleshooting

Cross-functional collaboration

Communication

Education

Engineering degree (Bachelors, Masters, or PhD)

Tools

ASM equipment

BESI/ASM equipment

ETS88 test systems

TDSON leadframes

Job description

Infineon Technologies in Batam, Indonesia, is seeking a Senior Staff/Principal Engineer for Molding, Mark, Trim & Form, Die Attach, Clip Attach, and Final Test, Scan & Pack (SON Package) in our Manufacturing and Operations team.

You will lead engineering activities, drive process optimization to improve test yield, quality, productivity, and cost, and supervise process and equipment qualification and characterization in a high-tech cleanroom environment.