Senior Staff Engineer – Semiconductor Packaging Leader

amIT Global Solutions Sdn Bhd; Indonesia; On-site; IDR 1,800,000,000 - 3,000,000,000; Full time

Job summary

Infineon Technologies is seeking a Senior Staff/Principal Engineer to lead and optimize molding, mark trim & form, die attach, clip attach, final test, scan, and pack processes for SON products in a high-tech semiconductor manufacturing environment in Indonesia.

The role requires 10+ years of experience across molding, marking, die attach, and final test, with strong leadership, cross-functional collaboration, and a track record of process improvement.

Qualifications

• Bachelor's/Master's/PhD in Engineering or related field.
• 10+ years of semiconductor manufacturing experience.
• Experience with Mold: Transfer Molding, BESI/ASM/Asahi equipment.
• Experience with Mark, Trim & Form processes using BESI/ASM equipment.
• Die Attach/Clip Attach knowledge with leadframe-based packages.
• Final Test, Scan and Pack experience including ETS88, SRM/Handler platforms.
• Strong leadership and cross-functional collaboration.
• Excellent communication and project management abilities.

Responsibilities

• Lead engineering activities for molding, mark trim & form, die attach, clip attach, final test, scan and pack for SON products.
• Drive process optimization to improve test yield, quality, productivity, equipment utilization and cost.
• Lead process and equipment qualification and process characterization.

Skills

Leadership

Project management

Cross-functional teamwork

Communication

Problem solving

Automation/industry 4.0

Education

Engineering degree (Bachelors/Masters/PhD)

Tools

BESI

ASM equipment

TDSON

ETS88

SRM

Job description

Infineon Technologies is seeking a Senior Staff/Principal Engineer to lead and optimize molding, mark trim & form, die attach, clip attach, final test, scan, and pack processes for SON products in a high-tech semiconductor manufacturing environment in Indonesia.

The role requires 10+ years of experience across molding, marking, die attach, and final test, with strong leadership, cross-functional collaboration, and a track record of process improvement.