Senior Staff Engineer - AI-Driven Test & Yield Leadership

Infineon Technologies AG; Batam; On-site; IDR 400,000,000 - 600,000,000; Full time

Job summary

Infineon Technologies AG in Batam seeks a Senior Staff Engineer Unit Process Engineering in Test to lead process development and equipment management. You will interface with customers, drive yield at final test, set KPIs, and guide engineers and technicians while implementing AI and advanced automation projects.

The role demands a Bachelor’s/Master’s in mechanical, material, chemical, or electrical engineering, with 8+ years in semiconductor backend packaging and 5+ years of team leadership.

Qualifications

• A Bachelor/Master Degree in Mechanical, Material, Chemical, or Electrical Engineering
• 8+ years experience in Semiconductor Backend Packaging
• 5+ years managing engineering teams
• Deep expertise in at least 2 AOI technologies; Soft Skills included
• Good communication in cross-functional collaboration and customer communication

Responsibilities

• Optimize scan processes, run DOE, establish Cpk/Ppk
• Manage AOI tools, Implement new projects related to Artificial Intelligence (AI) & Advanced Automation
• Define accept/reject criteria, lead failure analysis
• Drive Yield at Final Test
• Lead engineers & technicians, set KPIs, drive competency
• Develop scan recipes, FMEA, Control Plans for new products
• Lean/Six Sigma, reduce cycle time & false calls
• Present data, support audits, engage supplier.

Skills

Leadership

Cross-functional collaboration

Communication

Customer communication

Education

Bachelor’s/Master’s degree in Mechanical, Material, Chemical, or Electrical Engineering

Tools

AOI technologies

Job description

Infineon Technologies AG in Batam seeks a Senior Staff Engineer Unit Process Engineering in Test to lead process development and equipment management. You will interface with customers, drive yield at final test, set KPIs, and guide engineers and technicians while implementing AI and advanced automation projects.

The role demands a Bachelor’s/Master’s in mechanical, material, chemical, or electrical engineering, with 8+ years in semiconductor backend packaging and 5+ years of team leadership.