Multiple Engineering Opportunities | Infineon Batam

Infineon Technologies (Malaysia) Sdn Bhd; Batam; On-site; IDR 250,000,000 - 420,000,000; Full time

Job summary

Infineon Technologies (Malaysia) Sdn Bhd is hiring for multiple senior positions: Senior Staff Engineer/Principle Engineer in Final Test, Scan & Pack (SON Package). The role involves contributing to innovative semiconductor solutions and working across mold, marking, die attach, and final test processes with leading equipment.

Opportunity to work abroad in Batam, Indonesia. The candidate should hold a PhD/Master’s or Bachelor’s in Engineering and have extensive semiconductor manufacturing

Qualifications

• Bachelor’s, Master’s or PhD in Engineering (Electrical, Electronics, Mechanical, Materials, Manufacturing, Physics, Computer or related discipline)
• Minimum 10 years of semiconductor manufacturing experience with exposure to Mold (Transfer Molding) equipment, Marking/Trim & Form operations with BESI/ASM/Asahi equipment
• Experience with Final Test, Scan and Pack, ETS88 test systems, SRM (Scan and Reel Module) and ExisTech Handler platforms
• Strong communication, leadership and project management capabilities

Responsibilities

• Contribute to development of semiconductor solutions for greener energy, smart mobility, industrial automation and IoT
• Work in cross-functional, multinational environment to implement Final Test, Scan and Pack processes
• Possibly work abroad in Batam, Indonesia

Skills

Troubleshooting

Problem-solving

Leadership

Project management

Cross-functional collaboration

Communication

Education

Bachelor’s/Master’s/PhD in Engineering

Tools

BESI

ASM equipment

Asahi equipment

ETS88 Test Systems

ExisTech Handler

TDSON

STOLL

Job description

We are currently hiring for multiple positions:

Senior Staff Engineer/ Principle Engineer Final Test, Scan & Pack (SON Package)

About the Opportunity

As part of Infineon's engineering community, you will contribute to the development of innovative semiconductor solutions that enable greener energy, smart mobility, industrial automation, and IoT technologies.

Opportunity to working abroad Batam, Indonesia

Requirements :

Bachelor's Degree, Master’s degree or PhD in Engineering (Electrical, Electronics, Mechanical, Materials, Manufacturing, Physics, Computer or related discipline)

Minimum 10years of semiconductor manufacturing experience, with significant exposure to:

Mold : Transfer Molding processes, BESI, ASM and Asahi equipment.

Mark, Trim & Form: Marking Processes, Trim & Form operations, BESI and ASM equipment, TDSON or similar leadframe-based packages.

Die Attach / Clip Attach : Die Attach process or similar leadframe packages, Clip Attach Technology, Solder Paste and reflow processes, ASM Die Bonder platforms, Knowledge of leadframe-based power package assembly processes.

Final Test, Scan and Pack : Final Test operations, ETS88 Test Systems, SRM (Scan and Reel Module) processes, ExisTech Handler platforms.

Preferred Qualifications

Experience with solder paste, clip attach, and power package assembly technologies.

Familiarity with TDSON, STOLL or similar leadframe-based packages.

Final Test, Scan and Pack

Experience with ETS88 test platform development, optimization, and troubleshooting.

Strong knowledge of handler-test cell integration and automation systems.

Strong troubleshooting and problem-solving skills

Excellent communication, leadership, and project management capabilities

Ability to work effectively in a cross-functional and multinational environment.