Senior Staff Engineer: Molding & Final Test Lead

Infineon Technologies AG; Batam; On-site; IDR 1,004,400,000 - 1,674,000,000; Full time

Job summary

Infineon Technologies AG in Batam seeks a Senior Staff/Principal Engineer for Molding, Mark, Trim & Form, Die Attach, Clip Attach, Final Test, Scan & Pack (SON Package) in our Manufacturing and Operations team. You will lead engineering activities, optimize processes, and drive cost reductions in a high-tech cleanroom environment.

The ideal candidate holds a advanced engineering degree and 10+ years of semiconductor experience with specialist knowledge of mold, mark & form, die attach, and final

Qualifications

• Bachelor’s/Master’s/PhD in Engineering required.
• 10+ years semiconductor manufacturing experience with mold, marking, die attach, and final test.
• Experience with BESI/ASM equipment and TDSON or leadframe-based packages.

Responsibilities

• Lead molding, mark, trim & form, die attach, clip attach, and final test operations for SON products.
• Drive process optimization to improve yield, quality, productivity, and cost.
• Lead process and equipment qualification and characterization.

Skills

Leadership

Project management

Troubleshooting

Cross-functional collaboration

Communication

Education

Bachelor's/Master’s/PhD in Engineering

Tools

BESI equipment

ASM equipment

ETS88 test systems

ExisTech Handler

TDSON leadframe packages

Job description

Infineon Technologies AG in Batam seeks a Senior Staff/Principal Engineer for Molding, Mark, Trim & Form, Die Attach, Clip Attach, Final Test, Scan & Pack (SON Package) in our Manufacturing and Operations team. You will lead engineering activities, optimize processes, and drive cost reductions in a high-tech cleanroom environment.

The ideal candidate holds a advanced engineering degree and 10+ years of semiconductor experience with specialist knowledge of mold, mark & form, die attach, and final