Senior SMT Technical Manager / Engineering Manager

PT DBG Technology Indonesia; Batam; On-site; IDR 80,000,000 - 110,000,000; Full time

Job summary

PT DBG Technology Indonesia seeks a Senior SMT Technical Manager / Engineering Manager to lead end-to-end SMT/DIP processes, boost line OEE and yield, and drive NPI and line expansions. You will manage a high-performing technical team and engage with clients during audits.

The role requires strong leadership, deep SMT/DIP expertise, and a track record in EMS or automotive electronics environments. Industrial manufacturing excellence is the goal.

Qualifications

• Bachelor’s degree in Electronic Engineering or related field.
• 5 to 10+ years SMT/DIP engineering experience in electronics manufacturing.
• Minimum 3 to 5+ years direct management experience in a leadership role.
• Background in large-to-medium EMS, automotive electronics, or high-density PCBA manufacturing.
• Deep knowledge of 5S, Lean Manufacturing, and Six Sigma.

Responsibilities

• Oversee SMT/DIP processes including solder paste printing, FUJI placement, reflow soldering, AOI/SPI, and wave soldering.
• Analyze and resolve complex defect issues to improve OEE and First Pass Yield (FPY).
• Lead New Product Introduction (NPI) trial runs, equipment evaluations, line layout planning, and process validation.
• Independently lead technical engineering teams during client factory audits, technical reviews, and customer specification assessments.
• Organize collection, verification, and implementation of external technical documents, national standards, and customer golden samples.
• Formulate and drive departmental KPIs aligned with quality and environmental goals.
• Apply 5S, Lean Manufacturing, and Six Sigma to optimize workflows, minimize scrap, and control costs.
• Manage a sizable team of engineers and technicians, with performance evaluations and training.

Skills

Leadership

OEE optimization

Root-cause analysis

NPI management

Cross-functional collaboration

Education

Bachelor’s degree in Electronic Engineering or related field

Tools

FUJI placement equipment

AOI

SPI

Reflow soldering

Wave soldering

Job description

Senior SMT Technical Manager / Engineering Manager

We are seeking an experienced SMT Technical Manager to lead our engineering and technical operations. In this role, you will oversee end-to-end SMT/DIP technical processes, optimize line OEE and yield rates, lead new product introductions (NPI), and drive line expansion/validation. You will manage a high-performing technical team, interact directly with clients during technical audits, and collaborate cross-functionally to achieve world-class PCBA manufacturing excellence.

Key Responsibilities:

Technical Operations & Quality Optimization: Direct all SMT/DIP processes including solder paste printing, FUJI placement, reflow soldering, AOI/SPI inspection, and wave soldering. Analyze and resolve complex defect issues (e.g., cold solder, bridging, tombstoning) to improve OEE and First Pass Yield (FPY).

NPI & Equipment Validation: Lead New Product Introduction (NPI) trial runs, new equipment evaluations, line layout planning, and process validation.

Client & Technical Audits: Independently lead technical engineering teams during client factory audits, technical reviews, and customer specification assessments.

Technical Standards Management: Organize the collection, verification, and implementation of external technical documents, national standards, and customer golden samples.

Departmental Goal Execution: Formulate and drive departmental key performance indicators (KPIs) aligned with company quality and environmental goals.

Lean Manufacturing & Cost Control: Apply 5S, Lean Manufacturing, and Six Sigma tools to optimize workflows, minimize material scrap, reduce labor loss, and control operating costs.

Cross-Functional & Team Leadership: Manage a sizable team of engineers and technicians, executing performance evaluations and skill training. Collaborate seamlessly with Quality (QE), Production (PMC), and R&D teams.

Requirements:

Education: Bachelor’s Degree or above in Electronic Engineering, Electronic Science & Technology, Mechanical Automation, Mechatronics, Industrial Engineering (IE), or related fields.

Work Experience:

5 to 10+ years of SMT/DIP technical engineering experience in the electronics manufacturing industry.

Minimum 3 to 5+ years of direct management experience in a leadership role (Technical Manager, Engineering Supervisor, or Lead Engineer).

Background in large-to-medium EMS, automotive electronics, or high-density PCBA manufacturing plants is strongly preferred.

Technical Mastery:

Proficient in full SMT/DIP processes, including SPI, FUJI placement equipment, reflow, AOI/X-Ray, and wave soldering.

Strong expertise in NPI trial runs, equipment commissioning, and root-cause analysis for complex SMT defects.

Quality & Lean Methodologies:

Deep understanding of 5S, Lean Manufacturing, and Six Sigma frameworks.

Proven capability in driving line yield, OEE enhancement, and scrap reduction.

Leadership & Soft skills: Outstanding leadership capabilities to manage engineering teams, strong cross-departmental coordination, and robust pressure tolerance.