Process Engineer (Bonding Wire)

Heraeus Materials Singapore Pte Ltd; Hong Kong; On-site; HKD 300,000 - 540,000; Full time

Job summary

Heraeus Materials Singapore Pte Ltd in Hong Kong is seeking a Process Engineer to sustain and optimize bonding wire manufacturing processes. You will troubleshoot issues, drive continuous improvements, support new product introductions, and ensure product quality, yield, productivity and cost competitiveness.

The role involves collaborating with Manufacturing, Maintenance, NPI and QA teams to update procedures, lead CAPA actions, and monitor SPC/SQC metrics for on-time delivery.

Qualifications

• Bachelor/engineering degree in a related field.
• 2 years of relevant experience preferred.
• Knowledge of semiconductor interconnect materials preferred.
• Experience in mechanical processing and material characterization advantageous.
• Ability to resolve manufacturing process and product issues independently.
• Strong troubleshooting and problem-solving skills.
• Knowledge of SPC, Minitab or JMP is preferred.
• Knowledge of OHS and EMS.
• Understanding of Six Sigma, Lean Manufacturing, FMEA, DOE and root cause analysis methodologies is advantageous.

Responsibilities

• Lead or participate in metallurgical and materials projects involving micro-alloyed castings and bonding wire coating processes.
• Evaluate new machines, products, processes, and raw materials.
• Sustain and control existing manufacturing processes.
• Investigate and resolve production issues and customer complaints.
• Support daily bonding wire production activities related to process control and quality.
• Monitor key process variables, analyze deviations and implement corrective actions.
• Collaborate with cross-functional teams to update FMEA, Control Plan, and SOPs.
• Drive improvements in yield, productivity, scrap reduction, and on-time delivery; report KPI
• Work with suppliers and partners on automation and Industry 4.0 projects.
• Lead process control and technology improvement projects for cost competitiveness.

Skills

Troubleshooting

Problem solving

SPC

DOE & FMEA

Lean manufacturing

Root cause analysis

Education

Bachelor of Engineering or related field

Tools

Minitab

JMP

Job description

This Process Engineer responsible for sustaining and optimizing manufacturing processes, troubleshooting production issues, driving continuous process improvements, supporting new product introductions, and ensuring product quality, yield, productivity, and cost competitiveness in bonding wire manufacturing operations.

Job Responsibilities:

• Lead or participate in metallurgical and materials engineering projects involving micro-alloyed castings, mechanical deformation, thermo-mechanical treatment, and bonding wire coating processes, including:
• Evaluation of new machines, products, processes, and raw materials
• Sustaining and controlling existing manufacturing processes
• Investigation and resolution of production issues and customer complaints
• Support daily bonding wire production activities related to process control, equipment performance, product characteristics, quality assurance, and shipment requirements. Monitor key process variables, analyze deviations and variations, and implement corrective & preventive actions.
• Authorized to place lots on hold, initiate rework activities, and recommend disposition actions in accordance with quality management procedures.
• Collaborate with cross-functional teams, including Manufacturing, Maintenance, NPI, and Quality Assurance, to develop and improve processes, procedures, workflows, and updating FMEA, Control Plan, SOP documentation.
• Drive continuous improvements in yield, productivity, scrap reduction, cost savings, MES implementation, and on-time delivery (OTD) performance. Monitor SPC/SQC metrics, initiate corrective and preventive actions (CAPA), and provide regular KPI reporting to management.
• Work with suppliers and external partners to support manufacturing processes, equipment development, automation initiatives, and Industry 4.0 transformation projects.
• Lead or participate in process control and technology improvement projects to enhance product quality, manufacturing efficiency, product performance, and cost competitiveness while identifying opportunities for process simplification and automation.

Job Requirement:

• Bachelor of Engineering, Mechanical Engineering, Chemical Engineering, Electrical & Electronics Engineering, Physics, or related engineering fields.
• 2 years of relevant experience is preferred.
• Knowledge in Semiconductor interconnect, assembly materials related knowledge and practical experience preferred.
• Knowledge in mechanical processing, material characterization is highly advantageous.
• Experience in resolving a manufacturing process and product issues indepedently.
• Strong troubleshooting and solving skills.
• Knowledge in statistical tools(SPC, Minitab/JMP) is prefered.
• Knowledge in Occupational Health and Safety (OHS) and Environmental Management System (EMS).
• Understanding of Six Sigma, Lean Manufacturing, FMEA, DOE, and root cause analysis methodologies is advantageous.