Senior Process Engineer, PVD (JR13686)

STMicroelectronics Asia Pacific Pte Ltd; Hong Kong; On-site; HKD 420,000 - 640,000; Full time

Job summary

STMicroelectronics Asia Pacific Pte Ltd is seeking a Senior PVD Process Engineer to develop and qualify metal deposition processes on AMAT Endura platforms for semiconductor manufacturing. You will ensure process stability, film quality, and yield improvement across tooling and production lines.

The role focuses on optimizing metal PVD processes, supporting qualification, ramp-up, and transfer to high‑volume manufacturing, with collaboration across equipment, integration, yield, and production

Qualifications

• Bachelor's degree in engineering is required or similar.
• Minimum 3 years of process experience in Thin Film.
• Knowledge of metal deposition processes.
• Experience with copper deposition is a plus.
• Experience with AMAT Endura platform is preferred.

Responsibilities

• Develop and optimize metal PVD deposition processes on AMAT tools.
• Support process qualification, ramp-up, and transfer to high-volume manufacturing.
• Monitor and improve key process metrics including film thickness, sheet resistance, uniformity, adhesion, stress, defectivity, and yield.
• Troubleshoot process excursions, tool drift, defects, and yield loss issues.
• Analyze metrology, SPC, and inline data to identify root causes and implement corrective actions.
• Collaborate with equipment, integration, yield, and production teams.
• Drive continuous improvement to reduce cost, cycle time, and process variation.
• Document process procedures, specifications, and control plans.

Skills

PVD deposition

Thin Film

Process engineering

Copper deposition

AMAT Endura Tool Type

Education

Bachelor's degree in engineering

Tools

AMAT Endura Tool Type

Job description

Senior PVD Process Engineerresponsible for developing, qualifying, optimizing, and sustainingmetal deposition processesonApplied Materials (AMAT)Endura platforms. The role supports semiconductor manufacturing by ensuring process stability, film quality, equipment matching, defect control, and production yield improvement.

Key responsibilities:

• Develop and optimizemetal PVD depositionprocesses on AMAT tools.
• Support process qualification, ramp-up, and transfer to high-volume manufacturing.
• Monitor and improve key process metrics, including Film thickness, Sheet resistance, Uniformity, Adhesion, Stress, Defectivity, Yield
• Perform tool setup, chamber matching, and baseline process tuning.
• Troubleshoot process excursions, tool drift, abnormal defects, and yield loss issues.
• Analyze metrology, SPC, and inline data to identify root causes and implement corrective actions.
• Collaborate with equipment, integration, yield, and production teams.
• Support preventive maintenance, chamber health checks, and process stability initiatives.
• Drive continuous improvement to reduce cost, cycle time, and process variation.
• Document process procedures, specifications, and control plans.

YOUR SKILLS & EXPERIENCES

• Bachelor's degree in engineering discipline or similar
• Min 3 years of process experience in Thin Film
• Knowledge of Metal deposition process
• Additional experiences with copper deposition will be a plus point.
• Experience with AMAT Endura Tool Type