Engineer

DOCTECH HK LIMITED; Hong Kong; On-site; HKD 420,000 - 600,000; Full time

Benefits offered by this job

Restaurant d'entreprise

Indemnités de stage/alternance

Job summary

DOCTECH HK LIMITED in Hong Kong is seeking an Engineer to support R&D project execution and technical development. The role involves hands-on experimental work, data analysis, documentation, and contributing to meeting project milestones.

You will execute electroplating and semiconductor materials experiments, optimize processes, prepare samples, and maintain clear records. Collaboration with cross-functional teams and strict adherence to safety procedures are essential to drive timely

Qualifications

• Fresh PhD or Master’s with >2 years related experience.
• Hands-on lab experience and execution discipline.
• Ability to follow experimental plans and report results clearly.
• Strong problem-solving mindset and fast-learning in a research environment.
• Good communication and cross-functional teamwork.
• Experience in electroplating, electrochemistry, surface engineering, or semiconductor materials.
• Familiarity with advanced packaging and interconnect topics (e.g., copper electroplating, copper-to-copper bonding, redistribution layer, through-glass via, through-silicon via, copper foils).
• Experience with structured experiment planning and data-driven optimization.

Responsibilities

• Execute R&D experiments related to electroplating and semiconductor materials.
• Support process development, optimization, and troubleshooting.
• Prepare samples and assist with materials characterization and data interpretation.
• Maintain clear experiment records, organize data, and support technical reports.
• Coordinate with team members to ensure timely deliverables.
• Support laboratory operations, including materials prep, equipment readiness, and safety compliance.
• Perform other R&D duties to support project objectives.

Skills

Lab experimentation

Data analysis

Documentation

Cross-functional teamwork

Problem solving

Communication

Electroplating

Electrochemistry

Surface engineering

Semiconductor materials

Advanced packaging & interconnects

Experiment planning

Data-driven optimization

Education

PhD (Fresh)

Master’s with >2 years experience

Job description

We are hiring an Engineer to support research and development project execution and technical development. The Engineer will carry out hands‑on experimental work, support data analysis and documentation, and execute research and development project work, contributing to meeting deliverables on schedule and achieving project milestones.

Key Responsibilities

• Execute research and development experiments related to electroplating, surface treatment, and semiconductor materials
• Support process development activities, including parameter optimization, repeatability improvement, and troubleshooting
• Prepare samples and assist with materials characterization and basic data interpretation
• Maintain clear experiment records, organize data, and support preparation of technical reports and documentation
• Coordinate with team members to ensure tasks and deliverables are completed on time
• Support laboratory operation, including materials preparation, equipment readiness, and compliance with safety procedures
• Perform other research and development duties as assigned to support project objectives

Requirements

• Education level: Fresh PhD degree, or Master’s degree with more than 2 years of related experience
• Hands‑on laboratory experience and strong execution discipline
• Ability to follow experimental plans, maintain detailed records, and report results clearly
• Strong problem‑solving mindset and willingness to learn in a fast‑paced research environment
• Good communication skills and ability to work effectively with cross‑functional teams
• Experience in electroplating, electrochemistry, surface engineering, or semiconductor materials
• Familiarity with advanced packaging and interconnect topics (for example, copper electroplating, copper‑to‑copper bonding, redistribution layer, through‑glass via, through‑silicon via, copper foils)
• Experience with structured experiment planning and data‑driven optimization