Research Fellow

DOCTECH HK LIMITED; Hong Kong; On-site; HKD 900,000 - 1,300,000; Full time

Job summary

DOCTECH HK LIMITED is seeking a Research Fellow in Hong Kong who excels in application process development, analysis, and additives optimization. This senior role translates electroplating chemistry into stable, repeatable, and manufacturable processes for advanced packaging and functional materials.

You will design and conduct experiments, develop prototypes, analyze data, and prepare technical reports to meet project milestones across academia and industry.

Qualifications

• Master’s degree or PhD in Chemical Engineering, Chemistry, Materials Science or related discipline.
• 3+ years of R&D in semiconductor or functional materials processes and analysis.
• Strong additives optimization and translation of chemistry changes into process gains.
• Experience leading experimental design, parameter optimization and failure analysis.

Responsibilities

• Lead electroplating additives adjustment and bath tuning strategies.
• Own application process development and analysis for semiconductor materials.
• Design experiments, analyze results, and produce technical documentation.
• Mentor junior researchers and coordinate cross-project execution.
• Collaborate with internal teams and external partners to ensure milestones.

Skills

Process window development

Data-driven optimization

Application process development

Experimental design

Technical leadership

Team mentoring

Cross-functional collaboration

Technical writing

Education

Master’s degree or PhD in Chemical Engineering, Chemistry, Materials Science

Job description

We are looking for a Research Fellow who excels at application process development, analysis, and additives optimization. This is a senior technical role responsible for translating electroplating chemistry and materials research into stable, repeatable, and manufacturable processes for advanced packaging and functional materials. The ideal candidate is strong in process window development, data-driven optimization, and execution across research, academic, and industry environments.

As part of this role, you will be responsible for designing and conducting scientific experiments, developing and validating prototypes, analyzing data, preparing technical reports, and ensuring that research and development activities are executed effectively to achieve project milestones and deliverables within the project duration. Duties also include leading experimental design, coordinating laboratory work, contributing to innovation of processes and products, and supporting preparation of research and development documentation to meet project objectives and timelines.

Key Responsibilities

• Lead research and development and optimization on electroplating additives adjustment, including bath tuning strategies, performance stabilization, and repeatability improvement
• Own application process development and analysis for semiconductor and functional materials, including process mapping, structured optimization, capability studies, and root-cause troubleshooting
• Support technology development programs related to copper-to-copper bonding applications
• Design and execute experiments, analyze results, and deliver clear technical documentation (technical reports, process guidelines, internal standard operating procedures, and internal knowledge base)
• Lead experimental design, coordinate laboratory work, and contribute to innovation of processes and products to meet project milestones and timelines
• Provide technical leadership to junior researchers and engineers; coordinate execution across projects and ensure consistent experimental standards
• Collaborate with cross-functional teams (research and development, engineering, operations) and external partners to drive industrial readiness and customer validation
• Participate in technical exchanges and roadmap discussions to align technology development with market needs

Requirements

• Master’s degree or Doctor of Philosophy degree in Chemical Engineering, Chemistry, Materials Science, or related discipline
• More than 3 years of relevant research and development experience in semiconductor and/or functional materials application processes and analysis across research, academia, and industry environments
• Strong capability in additives optimization and adjustment and translating chemistry changes into measurable process performance improvements
• Hands-on experience with process development workflows: experimental design, parameter optimization, repeatability studies, and failure analysis
• Proven ability to lead research and development activities, coordinate teams, and deliver results under timelines
• Strong technical writing and communication skills (reports, documentation, stakeholder-ready summaries)
• Experience working across research institutes, industry, and academic environments, with strong adaptability and execution discipline
• Familiarity with advanced packaging and interconnect topics such as fine-pitch copper electroplating, bonding interfaces, through-glass via or through-silicon via, copper foils, or reliability-driven development
• Demonstrated track record of mentoring teams and driving cross-functional collaboration