Senior IC Layout Engineer

IC Resources; Oxford; Hybrid; GBP 90,000 - 120,000; Full time

Benefits offered by this job

RSU package

Hybrid working

Job summary

IC Resources is seeking a Senior IC Layout Engineer in Oxford. The role involves taking chip designs from requirements through physical implementation and tape-out in a hybrid work setting.

Ideal candidates have hands-on IC layout experience, multi-layer design skills, and familiarity with Cadence tools and manufacturing constraints. You will collaborate with design, engineering and fabrication partners to deliver complex chip projects.

Qualifications

• Experience with complex, multi-layer IC or semiconductor layout.
• Ability to translate requirements into physical designs and understand chip interactions.
• Experience taking designs through to tape-out.

Responsibilities

• Take ownership of chip designs through the full development process from requirements to tape-out.
• Translate system and design requirements into practical chip-level physical implementations.
• Design and lay out complex, multi-layer devices with detailed metal routing and interconnects.
• Consider interfaces and compatibility between technologies and components within the design.
• Collaborate with scientists, engineers and fabrication teams to understand requirements and resolve constraints.
• Work with multiple teams to ensure designs are feasible and aligned with manufacturing requirements.
• Identify and resolve layout and physical-design challenges throughout development.
• Take responsibility for projects and drive them through to tape-out.
• Contribute to improving layout methodologies, processes and automation within the design team.

Skills

IC layout

Cadence tools

Tape-out

Metal routing

Physical design

Design rules

Collaboration

Project ownership

Tools

Cadence

Job description

This is a new opportunity for a Senior IC Layout Engineer with an innovative deep-tech company specialising in advanced semiconductor technologies, based in Oxford. Hybrid working is available with this position, with a market-topping salary + RSU package.

As our client continues to scale their processor design team, they are looking for a Senior IC Layout Engineer to play a key role in taking complex chip designs from initial requirements through to physical implementation and tape-out.

This is a hands-on role suited to an experienced layout engineer who enjoys working closely with design, engineering, scientific and fabrication teams, and who is comfortable taking ownership of projects from concept through to final delivery.

Responsibilities

• Take ownership of chip designs through the full development process, from requirements and specifications through to layout and tape-out
• Translate system and design requirements into practical chip-level physical implementations
• Design and lay out complex, multi-layer semiconductor devices, including detailed metal routing and interconnects
• Consider interfaces and compatibility between different technologies and components within the overall design
• Work closely with scientists, engineers and fabrication partners to understand requirements and resolve design constraints
• Collaborate across multiple teams to ensure designs are technically feasible and compatible with manufacturing requirements
• Identify and resolve layout and physical-design challenges throughout the development process
• Take responsibility for individual projects and drive them through to successful tape-out
• Contribute to improving layout methodologies, processes and automation within the wider design team

Requirements

We're looking for an experienced engineer with strong hands-on IC layout experience and an understanding of the wider chip design process. You should be comfortable working across disciplines, translating requirements into physical designs and understanding how different elements of a chip interact and constrain one another.

You will ideally have experience with:

• Complex, multi-layer IC or semiconductor layout
• Metal routing and physical implementation
• Taking designs through to tape-out
• Cadence or equivalent IC layout tools
• Working with design rules, manufacturing constraints and physical design requirements
• Working collaboratively with scientists, engineers and fabrication teams
• Taking ownership of technically complex projects and delivering them independently