Senior Hardware Enigneer

IC Resources; Oxford; Hybrid; GBP 60,000 - 90,000; Full time

Benefits offered by this job

Hybrid working

Pension scheme

Life assurance

Income protection

Electric vehicle scheme

Cycle to Work

Learning and development

Cutting-edge technology

Full lifecycle exposure

Job summary

IC Resources is seeking a Senior HW Engineer – PCB Layout to join a growing deep-tech engineering team focused on advanced computing and high-performance electronic systems. You will own PCB layout activities from schematic handoff through to fabrication release, driving high-layer-count, high-speed PCBs using constraint-driven design methodologies.

You will develop stack-ups/HDI structures, implement controlled impedance routing, differential pairs, length matching and phase matching, and

Qualifications

• Extensive PCB layout experience on complex, high-speed electronic products.
• Proven experience delivering multilayer PCB designs into production.
• Strong experience with Cadence Allegro or Altium Designer.
• HDI PCB design experience (Microvias, Via-in-pad, stacked vias, back-drilling).

Responsibilities

• Own PCB layout activities from schematic handoff through to fabrication release.
• Design high-layer-count, high-speed PCBs using constraint-driven design methodologies.
• Develop stack-ups and HDI structures for complex electronic systems.
• Implement controlled impedance routing, differential pairs, length matching and phase matching requirements.
• Support BGA breakout and placement for large FPGAs, ASICs and fine-pitch devices.
• Translate SI/PI requirements into practical layout constraints.
• Work with hardware, mechanical and manufacturing teams to optimise performance and manufacturability.
• Produce manufacturing outputs including Gerber files, ODB++ and drill files.
• Lead DFM, DFA and DFT reviews.
• Act as the primary technical contact for PCB fabricators and assembly partners.
• Manage PCB libraries, CAD standards, footprints and design templates.
• Support product development from early prototypes through volume manufacture.

Skills

PCB layout

High-speed design

Differential routing

DFM awareness

Tools

Cadence Allegro

Altium Designer

Job description

We are looking for a Senior HW Engineer – PCB Layout to join a growing deep-tech engineering team developing advanced computing and high-performance electronic systems.

The Senior HW Engineer – PCB Layout will take ownership of complex PCB layouts, working closely with hardware, signal integrity and mechanical engineers.

The Senior HW Engineer – PCB Layout will play a key role in taking products from schematic capture through to manufacturing release.

What the Role Entails

• Own PCB layout activities from schematic handoff through to fabrication release.


• Design high-layer-count, high-speed PCBs using constraint-driven design methodologies.


• Develop stack-ups and HDI structures for complex electronic systems.


• Implement controlled impedance routing, differential pairs, length matching and phase matching requirements.


• Support BGA breakout and placement for large FPGAs, ASICs and fine-pitch devices.


• Translate SI/PI requirements into practical layout constraints.


• Work closely with hardware, mechanical and manufacturing teams to optimise design performance and manufacturability.


• Produce manufacturing outputs including Gerber files, ODB++, drill files, fabrication notes and assembly documentation.


• Lead DFM, DFA and DFT reviews.


• Act as the primary technical contact for PCB fabricators and assembly partners.


• Manage PCB libraries, CAD standards, footprints and design templates.


• Support product development from early prototypes through to volume manufacture.

Essential Requirements

• Extensive PCB layout experience on complex, high-speed electronic products.


• Proven experience delivering multilayer PCB designs into production.


• Strong experience with Cadence Allegro or Altium Designer.


• Experience designing HDI PCBs using technologies such as:


• Microvias


• Via-in-pad


• Stacked or staggered vias


• Back-drilling


• Experience with BGA breakout and placement of large, fine-pitch devices including FPGAs and ASICs.


• Strong understanding of high-speed design practices including:


• Controlled impedance routing


• Differential pair routing


• Length matching


• Signal integrity considerations


• Knowledge of IPC standards and PCB manufacturing requirements.


• Experience generating complete manufacturing documentation and release packages.


• Understanding of DFM, DFA and DFT principles.

Desirable Requirements

• Experience with ultra-high-speed digital interfaces.


• Experience working alongside SI/PI simulation engineers.


• Knowledge of FPGA-based hardware platforms.


• Experience with RF, microwave or mixed-signal PCB design.


• Experience with rigid-flex PCB technology.


• ECAD/MCAD collaboration experience.


• Thermal management and mechanical integration experience.


• Experience creating PCB libraries, design standards and CAD processes.


• Background working in high-performance computing, telecommunications, aerospace, defence or advanced technology sectors.

Benefits

• Competitive salary.


• Hybrid working.


• Pension scheme.


• Life assurance.


• Income protection insurance.


• Electric vehicle scheme.


• Cycle to Work scheme.


• Learning and development opportunities.


• Opportunity to work on cutting-edge technology products.


• Exposure to the full product lifecycle from concept through to production.