Senior Advanced Packaging & PDN Architect (2.5D/3D)

Axelera AI; Bristol; Hybrid; GBP 70,000 - 90,000; Full time

Benefits offered by this job

Attractive compensation package

Pension plan

Employee insurances

Option to get company shares

Job summary

Axelera AI is seeking a Senior Advanced Packaging & Power Delivery Engineer to shape the silicon architecture of AI accelerators. This role involves overseeing power delivery design and advancing packaging technologies. You will collaborate closely with cross-functional teams to ensure product alignment and performance.

The ideal candidate should possess a relevant degree and have over 7 years of experience in power delivery and packaging design in the semiconductor field. Flexible working arrangements are available, including remote options.

Qualifications

• 7+ years of experience in power delivery and/or advanced packaging design.
• Demonstrated expertise in on-die power grid design.
• Hands-on experience with 2.5D and/or 3D IC packaging technologies.

Responsibilities

• Own power-delivery design end to end.
• Lead advanced packaging architecture decisions.
• Perform SI/PI verification and sign-off.

Skills

Power delivery design

Advanced packaging technologies

Cross-functional collaboration

English communication

Education

Bachelor’s or Master’s degree in Electrical Engineering

Tools

EDA tools for power integrity

Job description

Axelera AI is seeking a Senior Advanced Packaging & Power Delivery Engineer to shape the silicon architecture of AI accelerators. This role involves overseeing power delivery design and advancing packaging technologies. You will collaborate closely with cross-functional teams to ensure product alignment and performance.

The ideal candidate should possess a relevant degree and have over 7 years of experience in power delivery and packaging design in the semiconductor field. Flexible working arrangements are available, including remote options.