Lead NPI Packaging Engineer — Semiconductors

IC Resources; United Kingdom; On-site; GBP 70,000 - 90,000; Full time

Job summary

IC Resources is seeking a Senior NPI Packaging Engineer to lead the development of advanced semiconductor packaging solutions from concept through manufacturing handover. You will work with global teams and OSAT partners to deliver reliable, scalable, and cost-effective packaging.

The role requires ~6 years in semiconductor packaging/NPI, strong knowledge of package technologies, and coordination across suppliers and internal teams.

Qualifications

• Master’s degree or higher in Electronics, Physics, Materials Science, Engineering, or related field.
• ~6 years’ experience in semiconductor packaging/NPI development.
• Strong knowledge of semiconductor assembly processes and package technologies.
• Experience with supplier design rules and 3D CAD tools (e.g., AutoCAD).
• Understanding of package thermal characterization.
• Ability to work with global cross-functional teams and external partners.
• Strong ownership, communication, and technical presentation skills.

Responsibilities

• Develop and optimize advanced semiconductor packages (wirebond, flip-chip, embedded, DFN/QFN, BGA, SiP, WLCSP).
• Evaluate packaging technologies and drive supplier/manufacturing partner development.
• Design packages to meet electrical, thermal, and form-factor requirements, including back-end wafer process considerations.
• Improve packaging design processes, tools, and methodologies for efficient NPI delivery.
• Support validation, testing, customer requirements, package drawings, thermal models, and technical documentation.
• Analyze assembly data and communicate technical findings.
• Maintain awareness of industry and academic developments in semiconductor packaging.

Skills

Semiconductor packaging

NPI development

Project leadership

Cross-functional teams

3D CAD tools

Thermal characterization

Communication

Education

Master's degree or higher in Electronics/Physics/Materials Science/Engineering

Tools

AutoCAD

Cadence Allegro X APD

Klayout

ANSYS

Job description

IC Resources is seeking a Senior NPI Packaging Engineer to lead the development of advanced semiconductor packaging solutions from concept through manufacturing handover. You will work with global teams and OSAT partners to deliver reliable, scalable, and cost-effective packaging.

The role requires ~6 years in semiconductor packaging/NPI, strong knowledge of package technologies, and coordination across suppliers and internal teams.