Principal Semiconductor Packaging Engineer

JR United Kingdom; Sheffield; On-site; GBP 50,000 - 75,000; Full time

Job summary

A leading Oxford-based client is seeking a Principal Semiconductor Packaging Engineer in Sheffield. The role involves steering the packaging roadmap, working with providers to develop quantum devices, and requires expertise in semiconductor and photonic packaging methods. Candidates should possess strong communication skills and experience in die bonding methods.

Qualifications

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies.
• Knowledge of die bonding methods for good thermal and mechanical performance.
• Experience working with 3rd party suppliers.

Responsibilities

• Steer the packaging roadmap for quantum processor devices.
• Design and supervise failure analysis experiments.
• Develop wirebond and bumping methods.

Skills

Semiconductor packaging methods

Photonics packaging methods

Die bonding methods

Communication skills

Job description

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Principal Semiconductor Packaging Engineer, sheffield, south yorkshire

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Client:

IC Resources

Location:

sheffield, south yorkshire, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.