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Une entreprise technologique de premier plan recherche un Ingénieur Principal en Emballage Semiconducteur à Lincoln. Le candidat sera chargé de développer des méthodes d'emballage pour des dispositifs quantiques et devra travailler en collaboration avec des fournisseurs internes et externes. Cette position requiert une expérience significative dans les méthodes d'emballage et une forte capacité de communication.
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IC Resources
lincoln, United Kingdom
Other
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Yes
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3
04.06.2025
19.07.2025
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Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
Please contact Rachel Anderson for further details.
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Created on 04/06/2025 by JR United Kingdom