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Principal Semiconductor Packaging Engineer

JR United Kingdom

Lincoln

On-site

GBP 60,000 - 90,000

Full time

2 days ago
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Job summary

Une entreprise technologique de premier plan recherche un Ingénieur Principal en Emballage Semiconducteur à Lincoln. Le candidat sera chargé de développer des méthodes d'emballage pour des dispositifs quantiques et devra travailler en collaboration avec des fournisseurs internes et externes. Cette position requiert une expérience significative dans les méthodes d'emballage et une forte capacité de communication.

Qualifications

  • Expérience des méthodes d'emballage/photoniques.
  • Savoir-faire en liaison de puces avec performances thermiques.
  • Expérience avec des fournisseurs tiers.

Responsibilities

  • Développer des méthodes d'emballage pour les dispositifs de processeurs quantiques.
  • Concevoir et superviser des expériences d'analyse des échecs.

Skills

Méthodes d'emballage des semiconducteurs
Connaissance des technologies de substrat
Méthodes de liaison de puces
Compétences en communication

Job description

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Principal Semiconductor Packaging Engineer, lincoln

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Client:

IC Resources

Location:

lincoln, United Kingdom

Job Category:

Other

-

EU work permit required:

Yes

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Job Views:

3

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

  • Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
  • Knowledge of die bonding methods for good thermal and mechanical performance
  • Experience working with 3rd party suppliers
  • Strong internal and external communication skills

Please contact Rachel Anderson for further details.

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Created on 04/06/2025 by JR United Kingdom

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