MEMS Packaging Engineer: Scale From Prototype to Production

microTECH Global LTD; Manchester; On-site; GBP 45,000 - 65,000; Full time

Job summary

microTECH Global LTD is seeking a hands-on MEMS Manufacturing Engineer to drive the transition from prototype to pilot-scale production. You will develop assembly processes, optimise workflows, and support scale-up with cross-disciplinary teams.

Ideal candidates have a degree in a technical field and 3+ years in MEMS/semiconductor manufacturing, with hands-on experience in die attach, wire bonding and precision assembly. Strong problem solving and documentation skills are essential.

Qualifications

• Degree required in a technical discipline (Engineering, Physics, Materials Science).
• 3+ years in semiconductor/MEMS/advanced technology manufacturing or similar.
• Experience with manufacturing procedures and documentation.
• Experience in cleanroom manufacturing environments.

Responsibilities

• Build and assemble MEMS prototype devices and subsystems.
• Develop and optimise manufacturing and assembly processes.
• Perform and improve die attach, wire bonding, packaging and precision assembly activities.
• Design and implement tooling, fixtures, jigs and assembly aids.
• Troubleshoot manufacturing, reliability and yield issues.
• Drive Design for Manufacture (DfM) and Design for Assembly (DfA) improvements.
• Create manufacturing documentation, SOPs and work instructions.
• Support New Product Introduction (NPI) and manufacturing scale-up activities.
• Work with external manufacturing, foundry and packaging partners as production grows.

Skills

Process development

Problem solving

Documentation

Cleanroom experience

Die attach

Wire bonding

DfM/DfA

Reliability testing

Failure analysis

Foundry collaboration

Education

Bachelor's degree in Engineering/Physics/Materials Science

Tools

CAD

Job description

microTECH Global LTD is seeking a hands-on MEMS Manufacturing Engineer to drive the transition from prototype to pilot-scale production. You will develop assembly processes, optimise workflows, and support scale-up with cross-disciplinary teams.

Ideal candidates have a degree in a technical field and 3+ years in MEMS/semiconductor manufacturing, with hands-on experience in die attach, wire bonding and precision assembly. Strong problem solving and documentation skills are essential.