Process Engineer

Octagon Group; Sedgefield; On-site; GBP 45,000 - 65,000; Full time

Job summary

Octagon Group is seeking a Process Engineer to join a high-technology manufacturing team. You will develop and optimise die attach and wire bonding processes for RF and microwave products, driving yield, quality and process improvements.

The role involves supporting NPI, process validation and continuous improvement, collaborating with Engineering, Quality and Production to document processes and control plans, and applying statistical analysis to reduce variation.

Qualifications

• Degree in Engineering, Materials Science, Physics or similar.
• Experience in semiconductor, RF, electronics or high-precision manufacturing.
• Hands-on experience with silver epoxy, silver sinter, eutectic die attach or gold wire bonding.
• Strong understanding of manufacturing processes and statistical analysis.
• Excellent problem-solving skills and a hands-on approach.

Responsibilities

• Develop and optimise die attach and wire bonding processes.
• Support NPI, DFM/DFA and process validation.
• Improve manufacturing yield, reliability and efficiency.
• Carry out process trials, root cause analysis and continuous improvement.
• Develop and document manufacturing processes and control plans.
• Work closely with Engineering, Quality and Production teams.

Skills

Die attach

Wire bonding

Process optimization

Root cause analysis

Continuous improvement

Problem solving

Statistical analysis

Education

Engineering/Materials/Physics degree

Job description

Process Engineer

An exciting opportunity for a Process Engineer to join a growing high-technology manufacturing team, supporting the development and introduction of advanced RF and microwave products into production.

The role will focus on developing and optimising semiconductor and RF assembly processes, particularly die attach and gold wire bonding, while driving yield, quality and process improvements.

Key Responsibilities

• Develop and optimise die attach and wire bonding processes
• Support NPI, DFM/DFA and process validation
• Improve manufacturing yield, reliability and efficiency
• Carry out process trials, root cause analysis and continuous improvement
• Develop and document manufacturing processes and control plans
• Work closely with Engineering, Quality and Production teams

Requirements

• Degree in Engineering, Materials Science, Physics or similar
• Experience in semiconductor, RF, electronics or high-precision manufacturing
• Hands-on experience with silver epoxy, silver sinter, eutectic die attach or gold wire bonding
• Strong understanding of manufacturing processes and statistical analysis
• Excellent problem-solving skills and a hands-on approach

Experience in automotive electronics, power electronics, RF manufacturing or contract manufacturing would be highly desirable.