Packaging Engineer

microTECH Global LTD; Manchester; On-site; GBP 45,000 - 65,000; Full time

Job summary

microTECH Global LTD is seeking a hands-on MEMS Manufacturing Engineer to drive the transition from prototype to pilot-scale production. You will develop assembly processes, optimise workflows, and support scale-up with cross-disciplinary teams.

Ideal candidates have a degree in a technical field and 3+ years in MEMS/semiconductor manufacturing, with hands-on experience in die attach, wire bonding and precision assembly. Strong problem solving and documentation skills are essential.

Qualifications

• Degree required in a technical discipline (Engineering, Physics, Materials Science).
• 3+ years in semiconductor/MEMS/advanced technology manufacturing or similar.
• Experience with manufacturing procedures and documentation.
• Experience in cleanroom manufacturing environments.

Responsibilities

• Build and assemble MEMS prototype devices and subsystems.
• Develop and optimise manufacturing and assembly processes.
• Perform and improve die attach, wire bonding, packaging and precision assembly activities.
• Design and implement tooling, fixtures, jigs and assembly aids.
• Troubleshoot manufacturing, reliability and yield issues.
• Drive Design for Manufacture (DfM) and Design for Assembly (DfA) improvements.
• Create manufacturing documentation, SOPs and work instructions.
• Support New Product Introduction (NPI) and manufacturing scale-up activities.
• Work with external manufacturing, foundry and packaging partners as production grows.

Skills

Process development

Problem solving

Documentation

Cleanroom experience

Die attach

Wire bonding

DfM/DfA

Reliability testing

Failure analysis

Foundry collaboration

Education

Bachelor's degree in Engineering/Physics/Materials Science

Tools

CAD

Job description

An exciting opportunity has arisen for a hands‑on MEMS Manufacturing Engineer to join an innovative deep-tech company developing next‑generation MEMS sensing technology.

This role will be instrumental in taking advanced MEMS devices from prototype development through to pilot‑scale manufacturing. Working closely with multidisciplinary engineering teams, you will develop assembly processes, optimise manufacturing workflows, improve yields, and support the transition from R&D into scalable production.

Key Responsibilities:

• Build and assemble MEMS‑based prototype devices and subsystems.
• Develop and optimise manufacturing and assembly processes.
• Perform and improve die attach, wire bonding, packaging and precision assembly activities.
• Design and implement tooling, fixtures, jigs and assembly aids.
• Troubleshoot manufacturing, reliability and yield issues.
• Drive Design for Manufacture (DfM) and Design for Assembly (DfA) improvements.
• Create manufacturing documentation, SOPs and work instructions.
• Support New Product Introduction (NPI) and manufacturing scale‑up activities.
• Work with external manufacturing, foundry and packaging partners as production grows.

Requirements:

• Degree in Engineering, Physics, Materials Science or a related discipline.
• 3+ years' experience within semiconductor, MEMS, photonics or advanced technology manufacturing.
• Experience with semiconductor packaging, die attach, wire bonding or precision assembly processes.
• Strong process development and problem‑solving skills.
• Experience developing manufacturing procedures and documentation.
• Comfortable working in a fast‑paced, hands‑on engineering environment.
• Cleanroom manufacturing environments.
• CAD design for fixtures and tooling.
• Reliability testing and failure analysis.

• Statistical Process Control (SPC).
• Wafer‑level or advanced semiconductor packaging.
• Working with foundries, OSATs or contract manufacturers.