Lead Semiconductor Packaging Engineer for Power MOSFETs

NEXPERIA B.V.; Manchester; Hybrid; GBP 90,000 - 130,000; Full time

Benefits offered by this job

Hybrid working policy

33 days annual leave including bankhol

Excellent pension scheme

Job summary

Nexperia is seeking a Principal Package Competence Engineer to drive advanced packaging for Power MOSFETs. You will lead package design studies, supervise industrialization, and coordinate with product lines, assembly sites, and R&D to shape the roadmap and maintain technology leadership.

The role requires deep expertise in semiconductor packaging, DOE, and data-driven problem solving, with a track record of innovation and stakeholder engagement.

Qualifications

• PhD with 5+ years of industry experience, or Bachelor's/Master's degree with 8+ years of relevant semiconductor experience.
• Extensive experience in semiconductor packaging and assembly technologies.
• Experience in power semiconductor technologies and applications.
• Proven track record of package innovation, technology development, or patent generation.
• Experience supporting global manufacturing and assembly organizations.
• Customer-facing experience and participation in technical discussions with external stakeholders.
• Strong understanding of semiconductor package materials, assembly processes, and reliability requirements.
• Experience with failure analysis, reliability testing, and root-cause investigations.
• Expertise in design of experiments (DOE), data analysis, and technical problem solving.
• Experience using advanced package design and simulation tools.
• Strong technical documentation and technical presentation skills.
• Ability to lead technical teams and influence stakeholders across multiple functions.
• Lead package design studies and development activities for new and existing semiconductor products.
• Serve as a recognized expert in semiconductor packaging and assembly technologies.
• Evaluate emerging package and process technologies to maintain technology leadership and competitive advantage.

Responsibilities

• Lead package design studies and development activities for new and existing semiconductor products.
• Provide expert support on package development, assembly processes, and industrialization activities.
• Mentor and develop junior engineers while promoting knowledge sharing across the organization.
• Contribute to package strategy development and long-term technology roadmaps.
• Act as a key technical interface between Business Groups and assembly manufacturing sites.
• Lead high-profile technical initiatives aligned with strategic business objectives.

Skills

Semiconductor packaging

Assembly technologies

Power semiconductor know-how

DOE & data analysis

Technical problem solving

Technical leadership

Stakeholder engagement

Documentation & presentations

Team leadership

Education

PhD

Bachelor/Master (Engineering)

Job description

Nexperia is seeking a Principal Package Competence Engineer to drive advanced packaging for Power MOSFETs. You will lead package design studies, supervise industrialization, and coordinate with product lines, assembly sites, and R&D to shape the roadmap and maintain technology leadership.

The role requires deep expertise in semiconductor packaging, DOE, and data-driven problem solving, with a track record of innovation and stakeholder engagement.