Senior Package Engineering Lead – Power Semiconductors

Nexperia; Greater Manchester; Hybrid; GBP 90,000 - 125,000; Full time

Benefits offered by this job

Visa sponsorship

Relocation assistance

Pension scheme

Life assurance

Job summary

Nexperia is seeking a Principal Package Competence Engineer in the UK to drive advanced semiconductor packaging and assembly technologies. You will lead studies, evaluate emerging package concepts, and shape the packaging roadmap across global teams and sites.

You will also mentor engineers, contribute to patents, and partner with Business Groups to align technology initiatives with strategic objectives. This role offers a hybrid working model with strong development opportunities.

Qualifications

• PhD with 5+ years of industry experience, or bachelor’s/master’s with 8+ years in semiconductors.
• Extensive experience in semiconductor packaging and assembly technologies.
• Experience with power semiconductor technologies and applications.
• Proven track record of package innovation or patents.
• Experience supporting global manufacturing and assembly organizations.
• Customer-facing experience and stakeholder collaboration.

Responsibilities

• Lead package design studies for new and existing products.
• Serve as expert in semiconductor packaging and assembly technologies.
• Evaluate emerging package technologies for leadership and competitiveness.
• Support validation of new package concepts via simulation and studies.
• Contribute to package strategy and long-term roadmaps.
• Interface between Business Groups and assembly sites.
• Mentor junior engineers and promote knowledge sharing.
• Lead technical projects on package development and process freeze.

Skills

Semiconductor packaging

DOE & data analysis

Project leadership

Global manufacturing support

Education

PhD

Tools

Advanced package design tools

Simulation software

Job description

Nexperia is seeking a Principal Package Competence Engineer in the UK to drive advanced semiconductor packaging and assembly technologies. You will lead studies, evaluate emerging package concepts, and shape the packaging roadmap across global teams and sites.

You will also mentor engineers, contribute to patents, and partner with Business Groups to align technology initiatives with strategic objectives. This role offers a hybrid working model with strong development opportunities.