Lead 2.5D/3D Packaging Architect - Hybrid & Relocation

IC Resources; Newport; Hybrid; GBP 90,000 - 130,000; Full time

Benefits offered by this job

Sponsorship + Relocation assistance

Private healthcare for you and your_?

Hybrid working

Company pension

Competitive salary + bonus

Job summary

A leading semiconductor organisation is seeking a Principal Packaging Engineer to shape advanced packaging architecture, 2.5D/3D integration and heterogeneous packaging across AI, HPC, RF, power and photonics.

The role requires technical leadership, hands-on prototyping, and the ability to guide customers and partners through architecture, prototyping, qualification and technology roadmaps. Hybrid working and relocation sponsorship are available.

Qualifications

• Strong experience in advanced semiconductor packaging and heterogeneous integration.
• Proven leadership of packaging development projects.
• Experience with 2.5D/3D packaging, chiplets and advanced assembly.
• Knowledge of signal integrity, power integrity and thermal management.
• Experience taking R&D concepts through to working prototypes or demonstrators.
• Excellent communication and problem-solving skills.

Responsibilities

• Architect advanced 2.5D/3D packaging and heterogeneous integration solutions
• Lead chiplet, interposer, TSV, high-density interconnect and hybrid bonding development
• Take packaging concepts from customer requirements through prototyping, demonstrators and qualification
• Define packaging technology roadmaps and drive long-term innovation
• Lead multidisciplinary technical projects across design, assembly, thermal and test
• Develop advanced microelectronic modules and system demonstrators
• Provide technical leadership across design, validation and qualification
• Support hands-on prototyping and laboratory development
• Contribute to technical proposals, bids and collaborative R&D programmes
• Manage technical risks and support technology decisions with customers and partners

Skills

Advanced semiconductor packaging

Heterogeneous integration

2.5D/3D packaging

Chiplets

Interposers

TSV

Hybrid bonding

Leadership

Communication

Problem solving

AI/HPC/Photonics knowledge

Job description

A leading semiconductor organisation is seeking a Principal Packaging Engineer to shape advanced packaging architecture, 2.5D/3D integration and heterogeneous packaging across AI, HPC, RF, power and photonics.

The role requires technical leadership, hands-on prototyping, and the ability to guide customers and partners through architecture, prototyping, qualification and technology roadmaps. Hybrid working and relocation sponsorship are available.