Global Field OSAT Support Engineer (Travel)

PragmatIC Semiconductor; New Brancepeth; Hybrid; GBP 40,000 - 60,000; Full time

Job summary

A leading technology company in the UK seeks a Technical Support Engineer to provide engineering support for inlay assembly and label conversion processes. Candidates should possess strong expertise in high-volume die attach processing and semiconductor manufacturing. The role involves significant travel (approx. 50%) to customer sites and requires excellent communication and interpersonal skills. The company offers an attractive benefits package, including Visa sponsorship and relocation support.

Qualifications

• Candidates should ideally have a degree related to the role or relevant experience.
• Willingness to travel significant time for customer support is essential.
• Strong interpersonal skills are required due to customer interactions.

Responsibilities

• Provide engineering support for inlay assembly and label conversion processes.
• Analyze and resolve machine issues rapidly.
• Develop expertise in TAL15K processes and machines.
• Work collaboratively with machine suppliers for solutions.
• Travel to customer sites approximately 50% of the time for support.
• Mentor and train staff while writing technical reports.

Skills

High-volume die attach processing

Semiconductor manufacturing

Communication and interpersonal skills

Reel-to-reel processing

PFMEA, PCP, OCAP

Label conversion processing

Education

Degree in a related discipline

Job description

A leading technology company in the UK seeks a Technical Support Engineer to provide engineering support for inlay assembly and label conversion processes. Candidates should possess strong expertise in high-volume die attach processing and semiconductor manufacturing. The role involves significant travel (approx. 50%) to customer sites and requires excellent communication and interpersonal skills. The company offers an attractive benefits package, including Visa sponsorship and relocation support.