Senior Digital IC Backend Engineer — Stock Options

Arago

Paris

Sur place

EUR 80 000 - 120 000

Plein temps

14 jours+
Générateur de candidature

Une candidature complète en une minute — un CV et une lettre de motivation personnalisés, prêts à être envoyés.

Passez les filtres ATS

Avantages offerts par ce poste

Competitive cash compensation
Stock option plan
Relocation bonus
Healthcare coverage
Pension contributions
Professional development support
25 days PTO
Public holidays
Transport subsidy

Résumé du poste

Arago is seeking a Digital Backend Design Engineer to implement physical designs from RTL to GDSII. You will work with RTL, DFT, and packaging teams to optimize PPA, timing, and yield while meeting tapeout deadlines.

You should have a PhD or master in EE, 4+ years in backend IC design, and strong Tcl scripting skills. English is required; French is a plus. This role offers relocation support and a fast-paced, engineering-led environment.

Qualifications

  • Master’s or PhD in Electrical/Electronic Engineering or related field.
  • 4+ years experience in digital IC backend implementation.
  • Proficiency with backend EDA tools, Cadence Innovus and Genus.
  • Strong understanding of P&R, STA, DRC/LVS, IR drop and EM analysis.
  • Experience with technology nodes 22nm or below.
  • Skilled in Tcl scripting for backend flows.
  • Experience in hierarchical or full-chip implementation is preferred.
  • English at proficient level; French is a plus.

Responsabilités

  • Execute full-chip and block-level physical design tasks including floorplanning, placement, clock tree synthesis, routing, and physical verification.
  • Develop and optimize the digital backend flow.
  • Drive timing closure, power optimization, and physical verification (LVS/DRC/ERC).
  • Collaborate with front-end designers to address timing and interface issues.
  • Support tapeout preparation and final sign-off processes.

Connaissances

Digital backend implementation
Place & route (P&R)
Static timing analysis (STA)
DRC/LVS verification
IR drop analysis
Electromigration (EM) analysis
Technology nodes 22nm or below
Tcl scripting
Hierarchical/full-chip implementation
English proficiency

Formation

Master’s or PhD in Electrical/Electronic Engineering

Outils

Cadence Innovus
Genus

Description du poste

Arago is seeking a Digital Backend Design Engineer to implement physical designs from RTL to GDSII. You will work with RTL, DFT, and packaging teams to optimize PPA, timing, and yield while meeting tapeout deadlines.

You should have a PhD or master in EE, 4+ years in backend IC design, and strong Tcl scripting skills. English is required; French is a plus. This role offers relocation support and a fast-paced, engineering-led environment.

Obtenez votre examen gratuit et confidentiel de votre CV.
ou faites glisser et déposez votre fichier ici.
Similar jobs

Postes similaires à comparer

Digital IC Backend Design Engineer
Digital IC Backend Design Engineer

Arago Inc. • Paris

Sur place
EUR 90 000 - 130 000
Competitive cash compensation
Meaningful stock option plan
Relocation bonus
+3
Digital IC Backend Design Engineer
Digital IC Backend Design Engineer

Arago • Paris

Sur place
EUR 80 000 - 120 000
Competitive cash compensation
Stock option plan
Relocation bonus
+6
Mixed-Signal IC Design Engineer: RTL to Tape-out + Stock
Mixed-Signal IC Design Engineer: RTL to Tape-out + Stock

Arago • Paris

Sur place
EUR 90 000 - 130 000
Stock options
Relocation bonus
Healthcare coverage
+2
Senior Digital IC Backend Architect (PPA & Tapeout)
Senior Digital IC Backend Architect (PPA & Tapeout)

Arago Inc. • Paris

Sur place
EUR 90 000 - 130 000
Competitive cash compensation
Meaningful stock option plan
Relocation bonus
+2
Senior Mixed-Signal IC Design Engineer
Senior Mixed-Signal IC Design Engineer

Arago • Paris

Sur place
EUR 90 000 - 150 000
Stock option plan
Relocation bonus and moving-expense覆盖
Healthcare coverage
+3
Mixed-Signal IC Design Engineer: RTL to Tape-Out
Mixed-Signal IC Design Engineer: RTL to Tape-Out

Arago Inc. • Paris

Sur place
EUR 110 000 - 140 000
Stock options
Relocation assistance
Healthcare coverage
+4
Mixed-Signal IC Design Engineer
Mixed-Signal IC Design Engineer

Arago • Paris

Sur place
EUR 90 000 - 150 000
Stock option plan
Relocation bonus and moving-expense覆盖
Healthcare coverage
+3
Mixed-Signal IC Design Engineer
Mixed-Signal IC Design Engineer

Arago • Paris

Sur place
EUR 90 000 - 130 000
Stock options
Relocation bonus
Healthcare coverage
+2
Senior Analog & Mixed-Signal IC Design Engineer
Senior Analog & Mixed-Signal IC Design Engineer

United States Digital Space LLC • Paris

Sur place
EUR 90 000 - 120 000
Stock options
Relocation bonus
Healthcare + pension contributions
+3
Mixed-Signal IC Design Engineer
Mixed-Signal IC Design Engineer

Arago Inc. • Paris

Sur place
EUR 110 000 - 140 000
Stock options
Relocation assistance
Healthcare coverage
+4