Senior 3D Quantum Integration Engineer

Quantum Software; Aubervilliers; Hybride; EUR 70 000 - 110 000; Plein temps

Avantages offerts par ce poste

BSPCE plan

IP bonuses

Remote policy up to 40%

Parental plan with extras

Urban Sports Club membership

Moka.care mental health support

25 days vacation + RTT

Transportation cost coverage or bike‑l

Meal vouchers Swile

French language courses

Résumé du poste

Quantum Software is seeking a Senior 3D Integration Engineer to join the Process Integration team within the Quantum Hardware & Infrastructure department in Aubervilliers, France. The role focuses on nanofabrication, assembly and scalable QPU design, collaborating across hardware functions from roadmap to packaging.

The candidate will identify, develop, and qualify 3D integration building blocks such as airbridges, TSV, and multi-layer wiring, while coordinating test plans and ensuring cryogenic

Qualifications

• PhD or MSc required in physics, materials science, electrical engineering, or microelectronics.
• 3+ years of 3D integration experience, including flip-chip / bump bonding and TSV processing.
• Experience from literature survey to go/no-go decision for integration processes.
• Strong background in failure analysis and reliability of 3D interconnects.
• Knowledge of cryogenic operation considerations for superconducting QPU fabrication is a plus.

Responsabilités

• Identify and benchmark 3D assembly technologies for QPUs under superconducting constraints.
• Develop and qualify 3D integration building blocks (airbridges, flip-chip, TSV, MLW, interconnects, wafer-level assembly).
• Coordinate integration test plans with cross-functional teams.
• Establish scalable, well-documented integration procedures for system growth.
• Investigate and resolve integration issues, ensuring alignment with specs and performance targets.
• Serve as technical contact for 3D integration with external foundries and packaging partners.

Connaissances

3D integration

Flip-chip bonding

TSV

Cleanroom

Failure analysis

Cryogenic operation

Interconnects

Formation

PhD or MSc in physics / materials science / electrical engineering / microelectronics

Outils

SEM

X-ray inspection

Tomography

Profilometry

Description du poste

Quantum Software is seeking a Senior 3D Integration Engineer to join the Process Integration team within the Quantum Hardware & Infrastructure department in Aubervilliers, France. The role focuses on nanofabrication, assembly and scalable QPU design, collaborating across hardware functions from roadmap to packaging.

The candidate will identify, develop, and qualify 3D integration building blocks such as airbridges, TSV, and multi-layer wiring, while coordinating test plans and ensuring cryogenic