Remote Quantum Process Integration Engineer

Limelight Health; Aubervilliers; Hybride; EUR 70 000 - 110 000; Plein temps

Avantages offerts par ce poste

BSPCE plan

Direct IP compensation

Flexible remote policy

Parental plan with additional benefits

Urban Sports Club membership

Mental health support

25 days vacation + RTT

Transportation cost coverage

Meal vouchers (Swile)

French language courses

Résumé du poste

Alice & Bob is building the first universal quantum computer and seeks a Process Integration specialist. You will work at the intersection of nanofabrication, assembly, and scalable QPU design to turn cutting-edge 3D integration concepts into a practical, scalable reality.

The role involves collaborating across the hardware organization—from roadmap definition to fabrication, packaging, and validation—to advance integration building blocks and reliable cryogenic interconnects for next‑gen

Qualifications

• PhD or MSc in physics, materials science, electrical engineering, or microelectronics, with strong hands-on cleanroom experience.
• 3+ years of demonstrated 3D integration experience in flip-chip / bump bonding and TSV processing.
• Proven track record of developing and qualifying an integration process brick end to end — literature survey, test-vehicle design, experiments, data analysis, and go/no-go decisions.
• Solid grounding in failure analysis and reliability assessment of 3D interconnects: cross-sectioning, SEM, X-ray inspection / tomography, profilometry, electrical test structures.
• Understanding of superconducting QPU fabrication and cryogenic operation demands is a plus.

Responsabilités

• Explore, identify, and benchmark 3D assembly technologies for QPUs under cryogenic constraints.
• Develop and qualify core 3D integration building blocks — airbridges, flip-chip bonding, TSV, MLW, superconducting interconnects.
• Design and drive integration test plans with cross-functional teams.
• Build scalable, well-documented integration procedures to support company growth.
• Dive into integration issues, diagnose root causes, ensure alignment with specs and performance targets.
• Serve as go-to technical contact for 3D integration with foundries, packaging partners, and equipment vendors.

Connaissances

3D integration

Flip-chip bonding

TSV processing

Failure analysis

Reliability assessment

Formation

PhD or MSc in physics, materials science, electrical engineering, or microelectronics

Outils

Cleanroom experience

SEM

X-ray inspection

Tomography

Profilometry

Description du poste

Alice & Bob is building the first universal quantum computer and seeks a Process Integration specialist. You will work at the intersection of nanofabrication, assembly, and scalable QPU design to turn cutting-edge 3D integration concepts into a practical, scalable reality.

The role involves collaborating across the hardware organization—from roadmap definition to fabrication, packaging, and validation—to advance integration building blocks and reliable cryogenic interconnects for next‑gen