Quantum Packaging & 3D-Integration Engineer

Varsity Capital; Paris; Hybride; EUR 60 000 - 78 000; Plein temps

Avantages offerts par ce poste

Salary 60k-78k EUR

Stock options

Conference sponsorship

International team

Meal vouchers

Mental health support

Training budget

Sabbatical after 2 years

Paris office spaces

Résumé du poste

C12 Quantum Electronics in Paris is seeking a 3D Integration Engineer to advance packaging and heterogeneous integration for scalable quantum hardware.

You will design interconnects between quantum devices, control electronics, photonics, and cryogenic systems while ensuring signal integrity, thermal performance, and reliability. We value hands-on experimentation and cross-disciplinary collaboration in a fast-growing startup.

Qualifications

• Bachelor’s or Master’s in electrical engineering, materials science, mechanical engineering, or related field.
• PhD or equivalent in advanced packaging or semiconductor integration.
• Experience with semiconductor packaging, wafer-level integration, MEMS, or heterogeneous integration.
• Familiar with wafer bonding, hybrid bonding, TSVs, flip-chip assembly, lithography, etching, electroplating, or CMP.
• Strong experimental, troubleshooting, documentation, and cross-functional communication skills.

Responsabilités

• Develop 2.5D and 3D integration architectures for quantum processors and supporting electronics.
• Design interposers, through-silicon vias, micro-bumps, hybrid bonds, redistribution layers, and chiplet interfaces.
• Integrate QPU with cryogenic CMOS, RF/microwave circuitry, photonics, MEMS, and packaging substrates.
• Perform electrical, electromagnetic, mechanical, and thermal simulations.
• Define fabrication flows and design rules with foundries, packaging partners, and internal process teams.
• Develop test vehicles and perform experimental measurements, analyze data to improve yield and performance.
• Document designs, process specifications, qualification results, and technology roadmaps.
• Collaborate with quantum-device, circuit-design, cryogenic, materials, manufacturing, and systems teams.

Connaissances

3D integration

experimental troubleshooting

cross-functional communication

signal integrity

thermal performance

Formation

Bachelor’s/Master’s in EE/Materials/Physics

PhD in advanced packaging/semiconductor integration

Outils

CAD

electromagnetic simulation tools

multiphysics simulation

semiconductor process-development tools

wafer bonding

Description du poste

C12 Quantum Electronics in Paris is seeking a 3D Integration Engineer to advance packaging and heterogeneous integration for scalable quantum hardware.

You will design interconnects between quantum devices, control electronics, photonics, and cryogenic systems while ensuring signal integrity, thermal performance, and reliability. We value hands-on experimentation and cross-disciplinary collaboration in a fast-growing startup.