Packaging and PCB Board Design Engineer

Quobly; Grenoble; Sur place; EUR 50 000 - 70 000; Plein temps

Résumé du poste

A cutting-edge tech startup in Grenoble is seeking a Packaging and PCB Board Design Engineer. The successful candidate will develop designs for PCB boards and semiconductor packaging solutions specifically for quantum chips. Applicants should have experience in RF applications and PCB design. This role offers an opportunity to work closely with a talented team in a dynamic environment focused on innovation.

Qualifications

• Experience designing PCBs for RF applications up to 20 GHz.
• Skilled in Flip Chip, Bump, or UBM technologies.
• Familiarity with cryogenic environments (around 1K).

Responsabilités

• Develop, design, and subcontract PCB boards based on chip specifications.
• Define semiconductor packaging solutions for the Qubit chip.
• Collaborate with diverse professionals in a culture of transparency.

Connaissances

PCB design for RF applications

Impedance-controlled traces

RF shielding

Signal integrity

RF simulation tools

Description du poste

Packaging and PCB Board Design Engineer

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Quobly aims to have a strong impact on society by providing cost-effective universal quantum processors to solve currently unsolvable problems.

Founded in 2022, Quobly is a fast-growing start-up located in Grenoble's vibrant and multidisciplinary ecosystem. The company benefits from strong links with the CNRS Neel Institute and CEA-Leti, fostering a dynamic environment connecting research and industry.

Quobly is expanding its team to focus on packaging and PCB board design for its quantum chips, aiming beyond 100 Qubits.

The role involves designing, developing, and subcontracting PCB fabrication, considering specific requirements of the chip, including RF signal integrity, thermal management, and cryogenic environment considerations.

What you will do daily at Quobly within the Integration Team:

• Develop, design, and subcontract PCB boards based on chip specifications.
• Define and propose semiconductor packaging solutions for the Qubit chip.
• Propose PCB partitioning to optimize testability and versatility.
• Collaborate with talented professionals from diverse backgrounds (software, hardware, quantum physics, characterization, measurement, quantum information theory) in a culture of transparency and autonomy.
• Work closely with technical team members.
• Contribute to industrial collaborations with CEA, CNRS, and STMicroelectronics.

You are suitable for this role because:

• You have experience designing PCBs for RF applications up to 20 GHz, including impedance-controlled traces, RF shielding, ground plane strategies, and signal integrity.
• You are skilled in Flip Chip, Bump, or UBM technologies.
• You have worked with QFP, BGA packages.
• You are familiar with matching networks and S-parameter analysis.
• You have experience with RF simulation tools and PCB design software.
• Experience with semiconductor packaging is preferred.
• Knowledge of thermal management at the package and board level is a plus.
• You are familiar with RF test equipment such as VNA, spectrum analyzers, and signal generators.
• You have knowledge of cryogenic environments (around 1K).

If you lack some skills but have a strong background, drive, and adaptability, we encourage you to apply! Your expertise and proactive attitude can make a significant impact.

Additional Details

• Seniority level: Mid-Senior level
• Employment type: Full-time
• Job function: Engineering and Design
• Industries: Semiconductor Manufacturing and Nanotechnology Research