Package Reliability Engineer – AI-Driven QA (Semiconductors)

micron; Marigot; Vor Ort; EUR 60.000 - 90.000; Vollzeit

Zusammenfassung

Micron Technology, Inc. is seeking a Global Quality (GQ) Package Reliability Engineer to lead qualification for new products and processes, coordinate reliability tests, and drive 8D problem-solving with cross-functional teams.

You will partner with customers to ensure release readiness, develop robust qualification plans, and apply AI-enabled insights to improve package quality and reliability across semiconductor packages and PCB assemblies.

Qualifikationen

• Bachelor’s or Master’s in Engineering (Mechanical, Electronics, Materials Science).
• 0–1 year of experience in Micro Electronic Packaging, Quality/Reliability Engineering/testing, or Failure Analysis.

Aufgaben

• Lead and coordinate package qualification efforts for new products and process introductions.
• Develop and implement robust qualification plans for new technologies and product developments.
• Provide recommendation on new product release readiness based on reliability assessment outcomes.
• Develop and devise reliability test plans to evaluate risks associated with excursions, conversions, and qualification issues.
• Coordinate root cause investigations and corrective action plans for qualification failures and customer RMAs.
• Prepare and present technical reports for internal and external partners.

Kenntnisse

Semiconductor packaging

Thermo-mechanical reliability

Reliability testing

Statistical methods

Project management

Technical communication

English language

8D problem solving

Ausbildung

Bachelor’s or Master’s in Engineering (Mechanical, Electronics, Materials Science)

Tools

SPC

FMEA

8D CAR

Jobbeschreibung

Micron Technology, Inc. is seeking a Global Quality (GQ) Package Reliability Engineer to lead qualification for new products and processes, coordinate reliability tests, and drive 8D problem-solving with cross-functional teams.

You will partner with customers to ensure release readiness, develop robust qualification plans, and apply AI-enabled insights to improve package quality and reliability across semiconductor packages and PCB assemblies.