An application made for this job — a tailored resume and cover letter that speak straight to the posting.
Micron Technology, Inc. seeks a senior Packaging Architect to own the package architecture from feasibility to tape-out and production readiness, coordinating across product, silicon, assembly, and OSAT teams to ensure robust, manufacturable solutions.
With a Master’s in Electrical Engineering and 10+ years in package design, you will drive design-rule workflows, mentoring engineers, and influencing roadmaps while integrating AI-enabled tools to enhance efficiency and quality.
Micron Technology, Inc. seeks a senior Packaging Architect to own the package architecture from feasibility to tape-out and production readiness, coordinating across product, silicon, assembly, and OSAT teams to ensure robust, manufacturable solutions.
With a Master’s in Electrical Engineering and 10+ years in package design, you will drive design-rule workflows, mentoring engineers, and influencing roadmaps while integrating AI-enabled tools to enhance efficiency and quality.