HBM Packaging Engineer for NPI & AI-Powered Innovation

micron; Marigot; On-site; EUR 63,000 - 91,000; Full time

Job summary

Micron Technology, Inc. seeks an Engineer for the Package Development Engineering Team in Singapore.

The role focuses on advancing next‑generation memory and HBM packaging technologies, transitioning new products from development to high‑volume manufacturing, and partnering with Development and Manufacturing teams globally. The ideal candidate will apply engineering and statistical methods, support AI-enabled improvements, and participate in technology transfers to ensure robust manufacturing

Qualifications

• Bachelor’s degree or higher in a relevant engineering field (Chemical/Materials/Electrical/Mechanical).
• Shift and weekend coverage is required.
• Strong analytical and logical thinking.
• Able to collaborate across all levels.
• Interest in semiconductor industry and Micron is preferred.

Responsibilities

• Integrate AI-assisted tools and insights to improve efficiency, quality, or effectiveness.
• Identify and test AI-enabled enhancements within your scope of work.
• Apply engineering and statistical methods from DOE to product qualifications.
• Support LVM and Run at Risk via collaboration with APDT and manufacturing teams.
• Perform FMEA and implement corrective actions for anomalies.
• Enable smooth technology transfer from development to high‑volume manufacturing.

Skills

Analytical thinking

Effective communication

Growth mindset

Leadership

AI literacy

Education

Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or related discipline

Tools

MES systems

Automation

Data analytics tools (JMP, Python)

Job description

Micron Technology, Inc. seeks an Engineer for the Package Development Engineering Team in Singapore.

The role focuses on advancing next‑generation memory and HBM packaging technologies, transitioning new products from development to high‑volume manufacturing, and partnering with Development and Manufacturing teams globally. The ideal candidate will apply engineering and statistical methods, support AI-enabled improvements, and participate in technology transfers to ensure robust manufacturing