Memory Packaging Pathfinding Architect — Edge AI & Datacenter

micron; Marigot; On-site; EUR 90,000 - 140,000; Full time

Job summary

Micron Technology, Inc. is seeking a Package Pathfinding Architect to drive next-generation memory packaging strategies and architectures across silicon, package, and system domains.

You will partner with customers and internal teams to advance edge-AI and datacenter memory platforms, delivering scalable, high-performance solutions. The role requires strong memory architecture expertise, hands-on package design experience, and the ability to influence cross-functional teams.

Qualifications

• Master’s degree or equivalent in EE, CE, CS, or related field.
• 5+ years of experience in package design, electrical simulations and tools like Ansys, Siemens and Cadence.
• Hands-on experience in memory systems package design, signaling, IO design, PDN design.
• Deep understanding of memory timing, signaling, power, package process technology.
• Experience with EDA tools for design, analysis and simulation (Cadence, Siemens and Ansys).
• Experience applying AI or LLMs for engineering efficiency.

Responsibilities

• Define next-generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance.
• Lead cross-stack co-optimization across silicon, package, board, and system with package-centric solutions approach.
• Drive long-term memory technology packaging strategy and influence industry standards.
• Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge-AI and datacenter memory products.
• Serve as a technical interface to internal partners, customers, BUs, senior leaders.
• Develop AI based EDA and internal automation tool sets for enhancing design cycle efficiency.
• Develop measurement automation for incoming substrate materials.

Skills

Analytical thinking

Data-driven mindset

Communication

Detail-oriented

Cross-functional collaboration

Problem solving

Education

Master’s degree in EE/CE/CS

PhD in related field (preferred)

Tools

Cadence

Siemens

Ansys

Python

MATLAB

JMP

Job description

Micron Technology, Inc. is seeking a Package Pathfinding Architect to drive next-generation memory packaging strategies and architectures across silicon, package, and system domains.

You will partner with customers and internal teams to advance edge-AI and datacenter memory platforms, delivering scalable, high-performance solutions. The role requires strong memory architecture expertise, hands-on package design experience, and the ability to influence cross-functional teams.