Quantum Device Fabrication Scientist (QPU & TSV)

VTT; Espoo; On-site; EUR 65,000 - 98,000; Full time

Job summary

VTT invites applications for a Research Scientist, QPU Integration and TSV Technologies, to join the Quantum Scaling and Integration team in Espoo. You will develop and qualify superconducting TSV processes on 200 mm wafers and collaborate with senior scientists, packaging teams, and European partners to bridge advanced quantum research with scalable manufacturing.

Your hands‑on expertise in microfabrication, lithography, deposition, and metrology will drive process integration and pilot‑scale

Qualifications

• Hands-on micro- and nanofabrication expertise for scalable quantum processor integration.
• Experience with lithography, dry etching, wet processing, and thin-film deposition.
• Understanding of process integration, metrology, and fabrication workflows.
• Experience with DOE, metrology data analysis, or process optimization.
• Good command of English.
• Preference for superconducting TSV fabrication or related knowledge.

Responsibilities

• Develop, optimise, and qualify superconducting TSV processes on 200 mm wafers.
• Perform thin film deposition, lithography, DRIE/RIE/ICP-RIE, and wet processing.
• Contribute to process integration, scaling, and tool matching across fabrication platforms.
• Plan and execute DOE campaigns and short-loop experiments for yield and performance optimisation.
• Improve process stability, reproducibility, and wafer‑scale uniformity.
• Carry out in‑line and wafer‑level characterisation such as SEM, electrical probing, and resistance mapping.
• Analyse relationships between process parameters and electrical and device performance.
• Support process monitoring, SPC, yield tracking, and KPI definition.
• Collaborate with internal teams and external partners in EU projects and research initiatives.
• Contribute to documentation, technology transfer, and pilot‑scale process development.

Skills

Lithography

Dry etching

Wet processing

Thin film deposition

Microfabrication

DOE campaigns

Metrology

Data analysis

Process integration

SPC & yield analysis

Documentation

Education

MSc or PhD in applied physics / electrical engineering / materials science / micro/nanotechnology

Tools

SEM

Electrical probing

Job description

VTT invites applications for a Research Scientist, QPU Integration and TSV Technologies, to join the Quantum Scaling and Integration team in Espoo. You will develop and qualify superconducting TSV processes on 200 mm wafers and collaborate with senior scientists, packaging teams, and European partners to bridge advanced quantum research with scalable manufacturing.

Your hands‑on expertise in microfabrication, lithography, deposition, and metrology will drive process integration and pilot‑scale