Research Scientist, QPU Integration and TSV Technologies

VTT

Espoo

On-site

EUR 65,000 - 98,000

Full time

31 hours ago

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Job summary

VTT invites applications for a Research Scientist, QPU Integration and TSV Technologies, to join the Quantum Scaling and Integration team in Espoo. You will develop and qualify superconducting TSV processes on 200 mm wafers and collaborate with senior scientists, packaging teams, and European partners to bridge advanced quantum research with scalable manufacturing.

Your hands‑on expertise in microfabrication, lithography, deposition, and metrology will drive process integration and pilot‑scale

Qualifications

Hands-on micro- and nanofabrication expertise for scalable quantum processor integration.
Experience with lithography, dry etching, wet processing, and thin-film deposition.
Understanding of process integration, metrology, and fabrication workflows.
Experience with DOE, metrology data analysis, or process optimization.
Good command of English.
Preference for superconducting TSV fabrication or related knowledge.

Responsibilities

Develop, optimise, and qualify superconducting TSV processes on 200 mm wafers.
Perform thin film deposition, lithography, DRIE/RIE/ICP-RIE, and wet processing.
Contribute to process integration, scaling, and tool matching across fabrication platforms.
Plan and execute DOE campaigns and short-loop experiments for yield and performance optimisation.
Improve process stability, reproducibility, and wafer‑scale uniformity.
Carry out in‑line and wafer‑level characterisation such as SEM, electrical probing, and resistance mapping.
Analyse relationships between process parameters and electrical and device performance.
Support process monitoring, SPC, yield tracking, and KPI definition.
Collaborate with internal teams and external partners in EU projects and research initiatives.
Contribute to documentation, technology transfer, and pilot‑scale process development.

Skills

Lithography

Dry etching

Wet processing

Thin film deposition

Microfabrication

DOE campaigns

Metrology

Data analysis

Process integration

SPC & yield analysis

Documentation

Education

MSc or PhD in applied physics / electrical engineering / materials science / micro/nanotechnology

Tools

SEM

Electrical probing

Job description

Are you interested in superconducting quantum device fabrication and three-dimensional integration? We are offering an exciting opportunity to develop through-silicon via technologies that enable the scaling of future quantum processors. Would you like to work hands-on in a state-of-the‑art cleanroom and turn advanced research into reproducible, pilot‑ready processes? VTT might be just the place for you.

VTT is one of the leading applied research organisations in Europe. What unites us are curiosity, a passion for learning, and a purpose: to solve the biggest challenges of our time and turn them into sustainable growth and well‑being. Our cross‑disciplinary community of over 2000 brilliant minds from 55+ different nationalities focuses on creating impact through science‑based innovation. In recent years, we have created ground‑breaking innovations such as the world's fastest and most accurate radiation detector, a cancer‑sniffing sensor device for smartphones, and a headphone set entirely made of microbial materials. Get to know us further by exploring VTT's tech & infra.

We are now looking for Research Scientist, QPU Integration and TSV Technologies to join our Quantum Scaling and Integration team.

You will join our Quantum Scaling and Integration Team, contributing to the development of superconducting through‑silicon via processes and QPU integration technologies on 200 mm wafers. In this role, you will develop, characterise, and optimise key fabrication modules in close collaboration with senior scientists, device integration experts, packaging teams, and European partners. You will help bridge advanced quantum research and scalable manufacturing.

Our Quantum Scaling and Integration Team develops advanced technologies for scaling superconducting quantum processors, from TSVs and multilayer wiring to flip‑chip integration and full QPU module concepts. We work closely with leading European industrial and academic partners to enable reproducible, wafer‑scale fabrication and pilot‑ready processes for future quantum computing systems.

As Research Scientist, QPU Integration and TSV Technologies, you will:

Develop, optimise, and qualify superconducting TSV processes on 200 mm wafers
Perform thin film deposition, lithography, DRIE/RIE/ICP-RIE, and wet processing
Contribute to process integration, scaling, and tool matching across fabrication platforms
Plan and execute DOE campaigns and short-loop experiments for yield and performance optimisation
Improve process stability, reproducibility, and wafer‑scale uniformity
Carry out in‑line and wafer‑level characterisation such as SEM, electrical probing, and resistance mapping
Analyse relationships between process parameters and electrical and device performance
Support process monitoring, SPC, yield tracking, and KPI definition
Collaborate with internal teams and external partners in EU projects and research initiatives
Contribute to documentation, technology transfer, and pilot‑scale process development

Who we are looking for:

For this position, we are looking for a hands‑on expert in micro‑and nanofabrication who is motivated to develop scalable integration technologies for quantum processors.
MSc or PhD in applied physics, electrical engineering, materials science, micro/nanotechnology, or similar
At least 3 years of hands‑on cleanroom experience, including thesis, PhD, or postdoctoral work
Experience in lithography, dry etching, wet processing, thin film deposition, and microfabrication processes
Understanding of process integration, characterisation, and fabrication workflows
Experience with DOE, metrology, data analysis, or process optimisation
Good command of English
We also appreciate experience in experience with superconducting TSV fabrication or superconducting materials; knowledge of CMP, wafer bonding, or advanced packaging; familiarity with SPC, yield analysis, or process control methodologies.

As a person, we hope that you are: