Senior Scientist, QPU Integration and TSV Technologies

Moventas Wind Ltd; Espoo; Hybrid; EUR 90,000 - 130,000; Full time

Job summary

VTT is seeking a Senior Scientist, QPU Integration and TSV Technologies to lead superconducting TSV and QPU integration efforts on 200 mm wafers. You will own technical workstreams, define process strategies, drive yield improvement, and coordinate with European industrial and academic partners to accelerate pilot-scale readiness.

The role requires deep microfabrication expertise, a proven track record in scaling R&D to pilot production, and strong leadership to mentor researchers and engineers

Job description

Senior Scientist, QPU Integration and TSV Technologies

Are you an experienced semiconductor or quantum device fabrication expert ready to lead a breakthrough integration technology? We are offering an opportunity to take technical ownership of superconducting through-silicon via and QPU integration processes, from concept to pilot-ready production. Would you like to shape Europe's quantum hardware roadmap while mentoring talented colleagues and collaborating with leading partners? VTT might be just the place for you.

VTT is one of the leading applied research organisations in Europe. What unites us are curiosity, a passion for learning, and a purpose: to solve the biggest challenges of our time and turn them into sustainable growth and well-being. Our cross-disciplinary community of over 2000 brilliant minds from 55+ different nationalities focuses on creating impact through science-based innovation. In recent years, we have created ground-breaking innovations such as the world's fastest and most accurate radiation detector, a cancer-sniffing sensor device for smartphones, and a headphone set entirely made of microbial materials. Get to know us further by exploring VTT's tech & infra .

We are now looking for Senior Scientist, QPU Integration and TSV Technologies to join our Quantum Scaling and Integration team.

You will join our Quantum Scaling and Integration Team and provide scientific and technical leadership across the full TSV and QPU integration process stack on 200 mm wafers. In this senior role, you will own technical workstreams, define process strategies, lead yield improvement and pilot-scale readiness, and collaborate closely with internal teams and European industrial and academic partners.

Our Quantum Scaling and Integration Team develops advanced technologies for scaling superconducting quantum processors, from TSVs and multilayer wiring to flip-chip integration and full QPU module concepts. We work closely with leading European industrial and academic partners to enable reproducible, wafer-scale fabrication and pilot-ready processes for future quantum computing systems.

As Senior Scientist, QPU Integration and TSV Technologies, you will:

• Lead the development, optimization, and qualification of superconducting TSV processes on 200 mm wafers
• Provide expert leadership in thin film deposition, lithography, DRIE/RIE/ICP-RIE, and wet processing
• Define and own the technical roadmap for TSV and QPU integration modules
• Drive process transfer, scaling, and tool-matching strategies across platforms
• Lead targeted DOE campaigns for yield, uniformity, and electrical performance optimization
• Establish and own SPC frameworks, process control points, yield KPIs, and quality guardrails
• Direct wafer-level characterization and correlate process parameters with Ic, Tc, uniformity, and QPU performance
• Lead production ramp-up planning, risk assessment, and pilot-scale readiness
• Provide technical leadership in EU, industrial, and academic projects
• Own technology transfer and documentation standards and mentor research scientists and engineers

Who we are looking for:

• For this position, we are looking for a senior expert in advanced microfabrication and integration who can independently lead superconducting TSV technologies from frontier research towards controlled, wafer-scale production.
• PhD in applied physics, electrical engineering, materials science, micro/nanotechnology, or similar
• At least 6 years of hands-on cleanroom experience, including PhD or postdoctoral work
• Expert-level skills in lithography, DRIE/RIE/ICP-RIE, wet processing, thin film deposition, and integration flows
• Strong experience with DOE, metrology, SPC, yield analysis, and process control
• Demonstrated success in scaling R&D processes towards pilot production
• Proven ability to own technical workstreams, lead projects, and guide junior colleagues
• We also appreciate experience in direct experience in superconducting TSV fabrication; knowledge of CMP, wafer bonding, or advanced packaging for 3D integration; familiarity with sheet resistance, stress measurement, probing, mask design, or RF simulations.

As a person, we hope that you are:

• A deep technical expert who leads by example and remains hands-on
• A natural mentor who invests in the success of colleagues
• Rigorous, disciplined, and data-driven, with high standards for quality
• A clear communicator who can work effectively with diverse stakeholders
• Comfortable taking ownership and making well-founded technical decisions
• Energized by turning frontier science into manufacturable quantum hardware

Interested and want to know more?

For further information, please contact Research Team Leader Harshad Mishra, [e-mail], [phone]

We look forward to hearing from you!

Please see our other open positions and read more about us from our career pages.

A security clearance procedure is conducted during the recruitment process.