Research Scientist, QPU Integration and TSV Technologies

Moventas Wind Ltd; Espoo; Hybrid; EUR 75,000 - 105,000; Full time

Job summary

VTT in Espoo, Finland, invites applications for a Research Scientist, QPU Integration and TSV Technologies, to advance superconducting TSV processes and QPU integration on 200 mm wafers.

You will develop, characterize, and optimize fabrication modules, collaborating with senior scientists, packaging teams, and European partners to bridge research and scalable manufacturing.

Qualifications

• MSc or PhD in applied physics, electrical engineering, materials science, micro/nanotechnology, or similar.
• Hands-on cleanroom experience with thesis, PhD, or postdoctoral work is required.
• Good command of English is essential.

Responsibilities

• Develop, optimize, and qualify superconducting TSV processes on 200 mm wafers.
• Perform thin film deposition, lithography, DRIE/RIE/ICP-RIE, and wet processing.
• Contribute to process integration, scaling, and tool matching across fabrication platforms.
• Plan and execute DOE campaigns and short-loop experiments for yield and performance optimization.
• Improve process stability, reproducibility, and wafer-scale uniformity.
• Carry out in-line and wafer-level characterization such as SEM, electrical probing, and resistance mapping.
• Analyze relationships between process parameters and electrical and device performance.
• Support process monitoring, SPC, yield tracking, and KPI definition.
• Collaborate with internal teams and external partners in EU projects and research initiatives.
• Contribute to documentation, technology transfer, and pilot-scale process development.

Skills

Microfabrication

Nanofabrication

Lithography

Dry etching

Wet processing

Thin film deposition

DOE campaigns

Metrology

Data analysis

Process optimization

SPC

English

Education

MSc or PhD in a relevant field

Tools

SEM

Electrical probing

Resistance mapping

Job description

Research Scientist, QPU Integration and TSV Technologies

Are you interested in superconducting quantum device fabrication and three-dimensional integration? We are offering an exciting opportunity to develop through-silicon via technologies that enable the scaling of future quantum processors. Would you like to work hands-on in a state-of-the-art cleanroom and turn advanced research into reproducible, pilot-ready processes? VTT might be just the place for you.

VTT is one of the leading applied research organisations in Europe. What unites us are curiosity, a passion for learning, and a purpose: to solve the biggest challenges of our time and turn them into sustainable growth and well-being. Our cross-disciplinary community of over 2000 brilliant minds from 55+ different nationalities focuses on creating impact through science-based innovation. In recent years, we have created ground-breaking innovations such as the world's fastest and most accurate radiation detector, a cancer-sniffing sensor device for smartphones, and a headphone set entirely made of microbial materials. Get to know us further by exploring VTT's tech & infra.

We are now looking for Research Scientist, QPU Integration and TSV Technologies to join our Quantum Scaling and Integration team.

You will join our Quantum Scaling and Integration Team, contributing to the development of superconducting through-silicon via processes and QPU integration technologies on 200 mm wafers. In this role, you will develop, characterize, and optimize key fabrication modules in close collaboration with senior scientists, device integration experts, packaging teams, and European partners. You will help bridge advanced quantum research and scalable manufacturing.

Our Quantum Scaling and Integration Team develops advanced technologies for scaling superconducting quantum processors, from TSVs and multilayer wiring to flip-chip integration and full QPU module concepts. We work closely with leading European industrial and academic partners to enable reproducible, wafer-scale fabrication and pilot-ready processes for future quantum computing systems.

As Research Scientist, QPU Integration and TSV Technologies, you will:

• Develop, optimize, and qualify superconducting TSV processes on 200 mm wafers


• Perform thin film deposition, lithography, DRIE/RIE/ICP-RIE, and wet processing


• Contribute to process integration, scaling, and tool matching across fabrication platforms


• Plan and execute DOE campaigns and short-loop experiments for yield and performance optimization


• Improve process stability, reproducibility, and wafer-scale uniformity


• Carry out in-line and wafer-level characterization such as SEM, electrical probing, and resistance mapping


• Analyze relationships between process parameters and electrical and device performance


• Support process monitoring, SPC, yield tracking, and KPI definition


• Collaborate with internal teams and external partners in EU projects and research initiatives


• Contribute to documentation, technology transfer, and pilot-scale process development

Who we are looking for:

• For this position, we are looking for a hands-on expert in micro- and nanofabrication who is motivated to develop scalable integration technologies for quantum processors.


• MSc or PhD in applied physics, electrical engineering, materials science, micro/nanotechnology, or similar


• At least 3 years of hands-on cleanroom experience, including thesis, PhD, or postdoctoral work


• Experience in lithography, dry etching, wet processing, thin film deposition, and microfabrication processes


• Understanding of process integration, characterization, and fabrication workflows


• Experience with DOE, metrology, data analysis, or process optimization


• Good command of English


• We also appreciate experience in experience with superconducting TSV fabrication or superconducting materials; knowledge of CMP, wafer bonding, or advanced packaging; familiarity with SPC, yield analysis, or process control methodologies.

As a person, we hope that you are:

• Hands-on, detail-oriented, and focused on data quality and experimental rigour


• A proactive problem solver with a continuous improvement mindset


• Eager to learn and grow in a technically demanding environment


• Able to work independently and in cross-functional teams


• A clear communicator who can explain technical topics to diverse audiences


• Structured and committed to quality, safety, and documentation

Interested and want to know more?

For further information, please contact Research Team Leader Harshad Mishra, [e-mail], [phone]

We look forward to hearing from you!

A security clearance procedure is conducted during the recruitment process.